NTQD6866R2
http://onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−8
CASE 948S−01
ISSUE A
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 2.90 3.10 0.114 0.122
B 4.30 4.50 0.169 0.177
C −−− 1.10 −−− 0.043
D 0.05 0.15 0.002 0.006
F 0.50 0.70 0.020 0.028
G 0.65 BSC 0.026 BSC
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
SEATING
PLANE
PIN 1
1
4
85
DETAIL E
B
C
D
A
G
L
2X L/2
−U−
S
U0.20 (0.008) T
S
U
M
0.10 (0.004) V
S
T
0.076 (0.003)
−T−
−V−
−W−
8x REFK
IDENT
K 0.19 0.30 0.007 0.012
S
U0.20 (0.008) T
P1
P
DETAIL E
F
M
0.25 (0.010)
K1
K
JJ1
SECTION N−N
J 0.09 0.20 0.004 0.008
K1 0.19 0.25 0.007 0.010
J1 0.09 0.16 0.004 0.006
P −−− 2.20 −−− 0.087
P1 −−− 3.20 −−− 0.126
N
N
mm
inches
0.038
0.95
0.252
6.4
0.018
0.45
0.026
0.65
0.177
4.5
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*