4
FN6395.0
November 22, 2006
Absolute Maximum Ratings Thermal Information
Supply Voltage (PVCC, VCC) . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V
EN
, V
PWM
) . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
BOOT Voltage (V
BOOT-GND
). . . -0.3V to 25V (DC) or 36V (<200ns)
BOOT To PHASE Voltage (V
BOOT-PHASE
). . . . . . -0.3V to 7V (DC)
-0.3V to 9V (<10ns)
PHASE Voltage . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 15V (DC)
GND -8V (<20ns Pulse Width, 10μJ) to 30V (<100ns)
UGATE Voltage . . . . . . . . . . . . . . . . V
PHASE
- 0.3V (DC) to V
BOOT
V
PHASE
- 5V (<20ns Pulse Width, 10μJ) to V
BOOT
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
GND - 2.5V (<20ns Pulse Width, 5μJ) to VCC + 0.3V
Ambient Temperature Range. . . . . . . . . . . . . . . . . .-40°C to +125°C
HBM ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2kV
Thermal Resistance (Typical) θ
JA
(°C/W) θ
JC
(°C/W)
SOIC Package (Note 1) . . . . . . . . . . . . 90 N/A
QFN Package (Notes 2 and 3). . . . . . . 46 8.5
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
(SOIC - Lead Tips Only)
Recommended Operating Conditions
Ambient Temperature Range. . . . . . . . . . . . . . . . . . .-40°C to +85°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
+150°C max junction temperature is intended for short periods of time to prevent shortening the lifetime. Constantly operated at 150°C may shorten the life of the part.
NOTES:
1. θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
3. θ
JC
, “case temperature” location is at the center of the package underside exposed pad. See Tech Brief TB379 for details.
Electrical Specifications These specifications apply for T
A
= -40°C to +85°C, unless otherwise noted
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
SUPPLY CURRENT
Bias Supply Current I
VCC+PVCC
PWM pin floating, V
VCC
= V
PVCC
= 5V - 240 - μA
F
PWM
= 300kHz, V
VCC
= V
PVCC
= 5V - 1.6 - mA
BOOTSTRAP DIODE
Forward Voltage V
F
Forward bias current = 2mA
T
A
= 0°C to +70°C
0.30 0.60 0.70 V
Forward bias current = 2mA
T
A
= -40°C to +85°C
0.30 0.60 0.75 V
POWER-ON RESET
POR Rising -3.44.2V
POR Falling 2.6 3.0 - V
Hysteresis - 400 - mV
PWM INPUT
Sinking Impedance R
PWM_SNK
-4.6-kΩ
Source Impedance R
PWM_SRC
-4.9-kΩ
Tri-State Rising Threshold V
VCC
= V
PVCC
= 5V (250mV Hysteresis) 1.00 1.20 1.40 V
Tri-State Falling Threshold V
VCC
= V
PVCC
= 5V(300mV Hysteresis) 3.10 3.41 3.70 V
Tri-State Shutdown Holdoff Time t
TSSHD
-80-ns
SWITCHING TIME (Note 4, See Figure 1)
UGATE Rise Time t
RU
3nF Load - 8.0 - ns
LGATE Rise Time t
RL
3nF Load - 8.0 - ns
UGATE Fall Time t
FU
3nF Load - 8.0 - ns
LGATE Fall Time t
FL
3nF Load - 4.0 - ns
UGATE Turn-Off Propagation Delay t
PDLU
Outputs Unloaded - 18 - ns
LGATE Turn-Off Propagation Delay t
PDLL
Outputs Unloaded - 25 - ns
ISL6610, ISL6610A
5
FN6395.0
November 22, 2006
Functional Pin Description
UGATE Turn-On Propagation Delay t
PDHU
Outputs Unloaded - 18 - ns
LGATE Turn-On Propagation Delay t
PDHL
Outputs Unloaded - 23 - ns
Tri-state to UG/LG Rising Propagation Delay t
PTS
Outputs Unloaded - 20 - ns
OUTPUT (Note 4)
Upper Drive Source Resistance R
UG_SRC
250mA Source Current - 1.0 2.5 Ω
Upper Drive Sink Resistance R
UG_SNK
250mA Sink Current - 1.0 2.5 Ω
Lower Drive Source Resistance R
LG_SRC
250mA Source Current - 1.0 2.5 Ω
Lower Drive Sink Resistance R
LG_SNK
250mA Sink Current - 0.4 1.0 Ω
NOTE:
4. Guaranteed by Characterization. Not 100% tested in production.
Electrical Specifications These specifications apply for T
A
= -40°C to +85°C, unless otherwise noted (Continued)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
PACKAGE PIN #
PIN
SYMBOL FUNCTIONSOIC DFN
1 15 PWM1 The PWM signal is the control input for the Channel 1 driver. The PWM signal can enter three distinct states during
operation, see the Tri-state PWM Input section under DESCRIPTION for further details. Connect this pin to the PWM
output of the controller.
2 16 PWM2 The PWM signal is the control input for the Channel 2 driver. The PWM signal can enter three distinct states during
operation, see the Tri-state PWM Input section under DESCRIPTION for further details. Connect this pin to the PWM
output of the controller.
3 1 GND Bias and reference ground. All signals are referenced to this node.
4 2 LGATE1 Lower gate drive output of Channel 1. Connect to gate of the low-side power N-Channel MOSFET.
5 3 PVCC This pin supplies power to both the lower and higher gate drives. Place a high quality low ESR ceramic capacitor
from this pin to PGND.
6 4 PGND Power ground return of both low gate drivers.
- 5,8 NC1,2 No connection.
7 6 LGATE2 Lower gate drive output of Channel 2. Connect to gate of the low-side power N-Channel MOSFET.
8 7 PHASE2 Connect this pin to the SOURCE of the upper MOSFET and the DRAIN of the lower MOSFET in Channel 2. This
pin provides a return path for the upper gate drive.
9 9 UGATE2 Upper gate drive output of Channel 2. Connect to gate of high-side power N-Channel MOSFET.
10 10 BOOT2 Floating bootstrap supply pin for the upper gate drive of Channel 2. Connect the bootstrap capacitor between this
pin and the PHASE2 pin. The bootstrap capacitor provides the charge to turn on the upper MOSFET. See the
Internal Bootstrap Device section under DESCRIPTION for guidance in choosing the capacitor value.
11 11 BOOT1 Floating bootstrap supply pin for the upper gate drive of Channel 1. Connect the bootstrap capacitor between this
pin and the PHASE1 pin. The bootstrap capacitor provides the charge to turn on the upper MOSFET. See the
Internal Bootstrap Device section under DESCRIPTION for guidance in choosing the capacitor value.
12 12 UGATE1 Upper gate drive output of Channel 1. Connect to gate of high-side power N-Channel MOSFET.
13 13 PHASE1 Connect this pin to the SOURCE of the upper MOSFET and the DRAIN of the lower MOSFET in Channel 1. This
pin provides a return path for the upper gate drive.
14 14 VCC Connect this pin to a +5V bias supply. It supplies power to internal analog circuits. Place a high quality low ESR
ceramic capacitor from this pin to GND.
- 17 PAD Connect this pad to the power ground plane (GND) via thermally enhanced connection.
ISL6610, ISL6610A
6
FN6395.0
November 22, 2006
Timing Diagram
Operation and Adaptive Shoot-Through Protection
Designed for high speed switching, the ISL6610, ISL6610A
MOSFET driver controls both high-side and low-side N-
Channel FETs from one externally provided PWM signal.
A rising transition on PWM initiates the turn-off of the lower
MOSFET (see Figure 1). After a short propagation delay
[t
PDLL
], the lower gate begins to fall. Typical fall times [t
FL
]
are provided in the Electrical Specifications. Adaptive shoot-
through circuitry monitors the LGATE voltage and turns on
the upper gate following a short delay time [t
PDHU
] after the
LGATE voltage drops below ~1V. The upper gate drive then
begins to rise [t
RU
] and the upper MOSFET turns on.
A falling transition on PWM indicates the turn-off of the upper
MOSFET and the turn-on of the lower MOSFET. A short
propagation delay [t
PDLU
] is encountered before the upper
gate begins to fall [t
FU
]. The adaptive shoot-through circuitry
monitors the UGATE-PHASE voltage and turns on the lower
MOSFET a short delay time, t
PDHL
, after the upper
MOSFET’s gate voltage drops below 1V. The lower gate then
rises [t
RL
], turning on the lower MOSFET. These methods
prevent both the lower and upper MOSFETs from conducting
simultaneously (shoot-through), while adapting the dead
time to the gate charge characteristics of the MOSFETs
being used.
This driver is optimized for voltage regulators with large step
down ratio. The lower MOSFET is usually sized larger
compared to the upper MOSFET because the lower
MOSFET conducts for a longer time during a switching
period. The lower gate driver is therefore sized much larger
to meet this application requirement. The 0.4Ω on-resistance
and 4A sink current capability enable the lower gate driver to
absorb the current injected into the lower gate through the
drain-to-gate capacitor (C
GD
) of the lower MOSFET and
help prevent shoot through caused by the self turn-on of the
lower MOSFET due to high dV/dt of the switching node.
Tri-State PWM Input
A unique feature of the ISL6610, ISL6610A is the adaptable
tri-state PWM input. Once the PWM signal enters the
shutdown window, either MOSFET previously conducting is
turned off. If the PWM signal remains within the shutdown
window for longer than 80ns of the previously conducting
MOSFET, the output drivers are disabled and both MOSFET
gates are pulled and held low. The shutdown state is
removed when the PWM signal moves outside the shutdown
window. The PWM rising and falling thresholds outlined in
the Electrical Specifications determine when the lower and
upper gates are enabled. During normal operation in a
typical application, the PWM rise and fall times through the
shutdown window should not exceed either output’s turn-off
propagation delay plus the MOSFET gate discharge time to
~1V. Abnormally long PWM signal transition times through
the shutdown window will simply introduce additional dead
time between turn off and turn on of the synchronous
bridge’s MOSFETs. For optimal performance, no more than
100pF parasitic capacitive load should be present on the
PWM line of ISL6610, ISL6610A (assuming an Intersil PWM
controller is used).
Bootstrap Considerations
This driver features an internal bootstrap diode. Simply
adding an external capacitor across the BOOT and PHASE
pins completes the bootstrap circuit. The ISL6610A’s internal
bootstrap resistor is designed to reduce the overcharging of
PWM
UGATE
LGATE
t
PDLL
t
PDHU
t
RU
t
PDLU
t
PDHL
t
RL
1V
2.5V
t
RU
t
FU
t
FL
1V
t
PTS
t
TSSHD
t
TSSHD
t
PTS
FIGURE 1. TIMING DIAGRAM
ISL6610, ISL6610A

ISL6610IRZ

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Gate Drivers DL 5V DRVRS DESKTOP COMPUTING 4X4 16LD
Lifecycle:
New from this manufacturer.
Delivery:
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