2.90 3.25
7.37
9.88
7
7.40 7.40
8.40
7
0.80
0.40
7.37
2.51
2.66
16.80
1
3.50
D0.10 C
7.25
0.95
0.4
0.4
C
D
0.4
16.80
18.20
12.5
B
A
A
B
0.05
FOR FS1-Z38-XXXX-XX
RECOMMENDED PCB LAYOUT
#1
NO TRACES OR INK MARKING ALLOWED
#38
B
L
KEEPOUT ZONE IN HATCHED AREAS
#19
#20
0.05
L
A
±0.05016.80
±0.050
1.80
1.55
1.55)(
2X
±0.030
0.35±0.030
REF.1
1.78 REF.
#1
#38 #20
1.14 MIN
15.53
18.20
1.65
5.35
5.60
16.60
MAR23/16ANDY CHEN
J. SI
D
C
B
A
A
B
C
D
ENG.REL.NO.
SCALE
SIZE
PROJECT
DWG. NO.
C
SHEET
REV.
DATE
APPROVALS
DRAWN
DESIGNED
CHECKED
QA APP'D
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILIMETERS
MAR23/16
J. SI
J. PEN
MAR23/16
A. CHEN MAR23/16
TOLERANCES ARE:
.X 0.2 2
0.1
MATERIAL AND FINISH
DO NOT SCALE DRAWING
123
45
6
7
8
8
76
54
32
1
E
F
E
F
IE APP'D
UltraPort QSFP 4x28
DWG APP'D
TITLE
AmphenolHighSpeedInterconnects
OR USED FOR MANUFACTURING PURPOSES WITHOUT PERMISSION FROM AMPHENOL CANADA CORP.
1 OF 1
ADivisionofAmphenolCorp.www.amphenol‐highspeed.com
THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE
38 POSITION CONNECTOR
P-FS1-Z38-X0Z6-60
FS1
03554
A. CHEN
NTS
A
MAR23/16
DECIMALS ANGLES
.XX
CODE IDENT. NO.
MAR23/16
NOTES:
1) MATERIAL:
HOUSING
: SOLDER REFLOW PROCESS COMPATIBLE LCP, UL94V-0
CONTACTS: PHOSPHOR BRONZE
RESONANCE DAMPENING FEATURE: CONDUCTIVE POLYMER
2) ROHS COMPLIANT
F S 1 - Z 3 8 - X 0 Z 6 - 6 0
CONTACT PLATING OPTION
2 = 30 MICRO INCHES MINIMUM OF GOLD ON MATING END
WITH 100 MICRO INCHES MINIMUM OF MATTE TIN ON
SOLDER TERMINATION, 50 MIN. MICRO INCHES OF
NICKEL UNDER PLATE ALL OVER
3 = 15 MICRO INCHES MINIMUM OF GOLD ON MATING END
WITH 100 MICRO INCHES MINIMUM OF MATTE TIN ON
SOLDER TERMINATION, 50 MIN. MICRO INCHES OF
NICKEL UNDER PLATE ALL OVER
REVISIONS
REV. DESCRIPTION DATE APPROVED
A INITIAL RELEASE MAR 23/16 J. SI
