DATASHEET
BoardLevelCooling–HighPowerExtruded5320
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
PartNumber “H”Dim “X”Dim “Y”Dim “Z”Dim
532602B00000G 38.10 12.70(0.50) 0.79(0.031) 2.67(0.105)
532602B02500G 38.10 12.70(0.50)‐2.67(0.105)
532702B02500G 50.80 12.65(0.498) ‐ 2.67(0.105)
532802B00000G 63.50 12.70(0.50) 0.79(0.031) 2.67(0.105)
532802B02500G 63.50 12.70(0.50) ‐ 2.67(0.105)
BOARDLEVELCOOLING–HighPowerExtruded5320
HighPowerExtruded5320isaseriesofdualradialboardlevelheatsinks
designedtocoolTO‐220andTO‐220‐singlegaugedevices.Representative
imageonly.
HEATSINKDETAILS
Property Details
Material Aluminum
Finish BlackAnodize
DeviceAttachmentOptions RequiresMountingKit
ThermalInterfaceMaterial ‐
ORDERINGINFORMATION
PartNumber DeviceType
532602B00000G TO‐220
532602B02500G TO‐220,TO‐220‐singlegauge
532702B02500G TO‐220,TO‐220‐singlegauge
532802B00000G TO‐220,TO‐220‐singlegauge
532802B02500G TO‐220,TO‐220‐singlegauge
PartNumbers:532602B00000Gand532802B00000G
Property Details
HeatSinkWidth(mm) 41.91
HeatSinkLength(mm) 25.40
HeatSinkHeight(mm) See“H”Dimbelow
HeatSinkMountingDirection Vertical
“H”