LTC4306IUFD#TRPBF Datasheet LTC4306IUFD#PBF, LTC4306CGN#PBF, LTC4306IGN#PBF | P19-P20

LTC4306

4306f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

GN Package

24-Lead Plastic SSOP

(Reference LTC DWG # 05-08-1641)

PACKAGE DESCRIPTIO

.337 – .344*

(8.560 – 8.738)

GN24 (SSOP) 0204

8 9 10 11 12

.229 – .244

(5.817 – 6.198)

.150 – .157**

(3.810 – 3.988)

161718192021222324

.016 – .050

(0.406 – 1.270)

.015

± .004

(0.38 ± 0.10)

× 45°

0° – 8° TYP

.0075 – .0098

(0.19 – 0.25)

.0532 – .0688

(1.35 – 1.75)

.008 – .012

(0.203 – 0.305)

TYP

.004 – .0098

(0.102 – 0.249)

.0250

(0.635)

BSC

.033

(0.838)

REF

.254 MIN

RECOMMENDED SOLDER PAD LAYOUT

.150 – .165

.0250 BSC.0165 ± .0015

.045 ±.005

*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

INCHES

(MILLIMETERS)

NOTE:

1. CONTROLLING DIMENSION: INCHES

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

UFD Package

24-Lead Plastic QFN (4mm x 5mm)

(Reference LTC DWG # 05-08-1696)

4.00 ± 0.10

(2 SIDES)

2.65 ± 0.10

(2 SIDES)

5.00 ± 0.10

(2 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ± 0.05

23 24

BOTTOM VIEW—EXPOSED PAD

3.65 ± 0.10

(2 SIDES)

0.75 ± 0.05

R = 0.115

TYP

PIN 1 NOTCH

R = 0.30 TYP

0.25 ± 0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UFD24) QFN 0505

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.70 ±0.05

0.25 ±0.05

0.50 BSC

2.65 ± 0.05

(2 SIDES)

3.65 ± 0.05

(2 SIDES)

4.10 ± 0.05

5.50 ± 0.05

3.10 ± 0.05

4.50 ± 0.05

PACKAGE

OUTLINE

LTC4306

4306f

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7417

(408) 432-1900

●

FAX: (408) 434-0507

●

www.linear.com

LT/LWI/TP 0805 500 • PRINTED IN USA

APPLICATIO S I FOR ATIO

WUUU

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Figure 8. Downstream Side Hot-Swapping Application

= 3.3V

TEMPERATURE

SENSOR

10k

0.01µF

10k

LED

MICRO-

CONTROLLER

VOLTAGE

MONITOR

10k

R10

10k

R11

10k

TEMPERATURE

SENSOR

R12

10k

R13

10k

R14

10k

VOLTAGE

MONITOR

I/O CARD

R15

10k

R16

10k

R17

10k

4306 F08

CC2

= 5V

CC3

= 2.5V

CC4

= 3.3V

OPEN

SCLIN

SDAIN

ENABLE

READY

GPI01

GPI02

ADR2

ADR1

ADR0

GND

SCL1

SDA1

SCL2

SDA2

SCL3

SDA3

SCL4

SDA4

ADDRESS = 1010 000

LTC4306UFD

ALERT4

ALERT3

ALERT2

ALERT

ALERT1

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18 P19-P20

LTC4306IUFD#TRPBF

Mfr. #:

Buy LTC4306IUFD#TRPBF

Manufacturer:

Analog Devices Inc.

Description:

Multiplexer Switch ICs 4:1 I2C MUX and Bus Buffer

Lifecycle:

New from this manufacturer.

Delivery:

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Payment:

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LTC4306IUFD#TRPBF

LTC4306IUFD#TRPBF

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