7 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
7.1 Soldering information
The HLGA (4.72 x 3.76 x 1.25) mm package is also compliant with the RoHS and “Green”
standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Landing pattern and soldering recommendations are available at www.st.com.
Figure 6: Recommended soldering profile limits
Table 8: Recommended soldering profile limits
Description Parameter Pb free
Average ramp rate T
L
to T
P
3 °C/sec max
Preheat
Minimum temperature
Maximum temperature
Time (T
SMIN
to T
SMAX
)
T
SMIN
T
SMAX
t
S
150 °C
200 °C
60 sec to 120 sec
Ramp-up rate T
SMAX
to T
L
Time maintained above liquidus temperature
Liquidus temperature
t
L
T
L
60 sec to 150 sec
217 °C
Peak temperature T
P
260 °C max
Time within 5 °C of actual peak temperature
20 sec to 40 sec
Ramp-down rate
6 °C/sec max
Time 25 °C (t25 °C) to peak temperature
8 minutes max
Obsolete Product(s) - Obsolete Product(s)
