MP1494 – SYNCHRONOUS STEP-DOWN CONVERTER
MP1494 Rev. 1.04 www.MonolithicPower.com 2
12/26/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2012 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number* Package Top Marking
MP1494DJ TSOT-23-8 ABZ
For Tape & Reel, add suffix –Z (e.g. MP1494DJ–Z);
For RoHS, compliant packaging, add suffix –LF (e.g. MP1494DJ–LF–Z).
PACKAGE REFERENCE
ABSOLUTE MAXIMUM RATINGS
(1)
V
IN
..................................................-0.3V to 17V
V
SW
......................................................................
-0.3V (-5V for <10ns) to 17V (19V for <10ns)
V
BS
......................................................... V
SW
+6V
All Other Pins................................ -0.3V to 6V
(2)
Continuous Power Dissipation (T
A
= +25°C)
(3)
........................................................... 1.25W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature................. -65°C to 150°C
Recommended Operating Conditions
(4)
Supply Voltage V
IN
...........................4.5V to 16V
Output Voltage V
OUT
..................... 0.8V to V
IN
-3V
Operating Junction Temp. (T
J
). -40°C to +125°C
Thermal Resistance
(5)
θ
JA
θ
JC
TSOT-23-8............................. 100 ..... 55... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) About the details of EN pin’s ABS MAX rating, please refer to
Page 9, Enable/SYNC control section.
3) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX) = (T
J
(MAX)-T
A
)/
JA
. Exceeding the maximum allowable powe
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
4) The device is not guaranteed to function outside of its
operating conditions.
5) Measured on JESD51-7, 4-layer PCB.
