SpecNo.JENF243J-0011A-01 P3/10
MURATA MFG.CO., LTD
Reference
Only
7.Mechanical Performance
No. Item Specification Test Method
7.1 Shear Test Chip Noise Filter shall not be damaged. Substrate: Glass-epoxy substrate
Force: 10N
Hold Duration: 5±1s
7.2 Bending Test Substrate: Glass-epoxy substrate
(100×40×1.6mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 5s
(in mm)
7.3 Vibration Chip Noise Filter shall not be damaged.
Oscillation Frequency : 10 to 2000 to 10Hz for 20 min
Total amplitude : 1.5 mm or Acceleration amplitude
98 m/s
2
whichever is smaller.
Testing Time: A period of 2 hours in each of
3 mutually perpendicular directions.
(Total 6 hours)
7.4 Solderability The wetting area of the electrode shall
be at least 90% covered with new
solder coating.
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 240±5°C
Immersion Time: 3±1 s
7.5 Resistance to
Soldering Heat
Appearance: No damage
Impedance Change: within ± 10%
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
45
R230
F
Deflection
45
Product
Pressure jig
Ｆ
Chip Coil
Substrate
