IRDC3137

IRDC3137
1
Rev. 1.0
06/30/03
www.irf.com
SPECIFICATION DATAINTRODUCTION
IRU3137 EVALUATION BOARD USER GUIDE
INPUT/OUTPUT CONNECTIONS
The IRU3137 controller IC is designed to provide a low
cost and high performance synchronous Buck regulator
for on-board DC to DC converter applications. The out-
put voltage can be set as low as 0.8V and higher voltage
can be obtained with an external voltage divider. High
peak current gate drivers provide fast switching transi-
tion for applications requiring high output current in the
range of 15A to 20A.
This device features an internal 200KHz oscillator, un-
der-voltage lockout for both Vcc and Vc supplies, an
external programmable soft-start function as well as out-
put under-voltage detection that latches off the device
when an output short is detected.
VIN = 5V
VOUT = 2.5V
IOUT = 15A
DVOUT = 75mV
FS = 200KHz
The following is the input/output connections:
Inputs:
JP1: Input (+5V), Gnd
JP4: Input (+12V), Gnd
Outputs:
JP2: VOUT (+2.5V)
JP3: Gnd
The connection points is shown in Figure 1. Connect the
power supply cables according to this figure, minimize
wire lengths to reduce losses in the wire. Test point J1
provides easy connections for the oscilloscope voltage
probe to monitor the output voltage.
Supply Voltage:
VCC = VC = 12V
Note: For proper operation, +5V supply should ramp up first.
2
Rev. 1.0
06/30/03
IRDC3137
www.irf.com
Figure 1 - Connection diagram of evaluation-board for IRU3137.
CONNECTION DIAGRAM
Power Supply
Gnd
+12V
1A Supply
Load
0 - 15A
Power Supply
Gnd
+5V
10A Supply
IRDC3137
3
Rev. 1.0
06/30/03
www.irf.com
The four layers for IRU3137 evaluation board are shown
in Figures 2.1-2.4. The layout is designed both for direct
FET package and SOIC package for power MOSFETs.
The input capacitors are all located close to the
MOSFETs. All the decoupling capacitors and feedback
components are located close to IC. The feedback re-
sistors are tied to the output voltage at the point of regu-
lation.
The middle layers are dedicated to Power Ground and
Analog Ground. Analog Ground is kept separated from
the Power Ground and it is connected at a single point
as shown in figure 2.3.
LAYOUT
Figure 2.1 - Top layer of evaluation-board for IRU3137.

IRDC3137

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
KIT REFERENCE DESIGN W/IRU3137
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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