MRF5S19150HR3

4
RF Device Data
Freescale Semiconductor
MRF5S19150HR3
Figure 2. MRF5S19150HR3 Test Circuit Component Layout
C1
R1
R2
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
MRF5S19150
Rev 4
R3
V
GG
V
DD
R4
B1
CUT OUT AREA
B2
C16
C17 C18
C19 C20
C21 C22
C23
C24
C25
C26
C27
C28 C29
C30 C31
C32 C33
Freescale has begun the transition of marking Printed Circuit Boards (PCBs) with the Freescale Semiconductor
signature/logo. PCBs may have either Motorola or Freescale markings during the transition period. These changes will have
no impact on form, fit or function of the current product.
MRF5S19150HR3
5
RF Device Data
Freescale Semiconductor
TYPICAL CHARACTERISTICS
2020
5
15
1900
−55
40
IRL
G
ps
ACPR
IM3
f, FREQUENCY (MHz)
Figure 3. 2- Carrier N -CDMA Broadband Performance
@ P
out
= 32 Watts Avg.
G
ps
, POWER GAIN (dB)
−60
−10
−20
−30
−40
INPUT RETURN LOSS (dB)IRL,
V
DD
= 28 Vdc, P
out
= 32 W (Avg.), I
DQ
= 1400 mA
2−Carrier N−CDMA, 2.5 MHz Carrier Spacing
1.228 MHz Channel Bandwidth
PAR = 9.8 dB @ 0.01% Probability (CCDF)
IM3 (dBc), ACPR (dBc)
−50
14 35
13 30
12 25
11 20
10 −30
9 −35
8 −40
7 −45
6 −50
1920 1940 1960 1980 2000
100
11
16
1
P
out
, OUTPUT POWER (WATTS) PEP
Figure 4. Two- Tone Power Gain versus
Output Power
G
ps
, POWER GAIN (dB)
10
15
14
13
12
I
DQ
= 2100 mA
1700 mA
V
DD
= 28 Vdc
f1 = 1958.75 MHz, f2 = 1961.25 MHz
Two−Tone Measurement, 2.5 MHz Tone Spacing
1400 mA
700 mA
1050 mA
100
−55
−15
1
I
DQ
= 2100 mA
1700 mA
P
out
, OUTPUT POWER (WATTS) PEP
Figure 5. Third Order Intermodulation versus
Output Power
V
DD
= 28 Vdc
f1 = 1958.75 MHz, f2 = 1961.25 MHz
Two−Tone Measurement, 2.5 MHz Tone Spacing
10
1400 mA
700 mA
1050 mA
−20
−25
−30
−35
−40
−45
−50
10
−60
−20
0.1
TWO−TONE SPACING (MHz)
Figure 6. Intermodulation Distortion Products
versus Tone Spacing
INTERMODULATION DISTORTION (dBc)IMD,
3rd Order
V
DD
= 28 Vdc, P
out
= 150 W (PEP), I
DQ
= 1400 mA
Two−Tone Measurements
(f1 + f2)/2 = Center Frequency of 1960 MHz
5th Order
7th Order
−25
−30
−35
−40
−45
−50
−55
1
45
49
59
35
P3dB = 53.71 dBm (234.96 W)
P
in
, INPUT POWER (dBm)
Figure 7. Pulse CW Output Power versus
Input Power
P
out
, OUTPUT POWER (dBm)
V
DD
= 28 Vdc, I
DQ
= 1400 mA
Pulsed CW, 8 µsec (on), 1 msec (off)
f = 1960 MHz
444342414039383736
58
57
56
55
54
53
52
51
50
P1dB = 53.01 dBm (199.99 W)
η
D
, DRAIN
EFFICIENCY (%)
η
D
INTERMODULATION DISTORTION (dBc)
IMD, THIRD ORDER
6
RF Device Data
Freescale Semiconductor
MRF5S19150HR3
TYPICAL CHARACTERISTICS
10
0
45
−70
−25
G
ps
IM3
P
out
, OUTPUT POWER (WATTS) AVG., N−CDMA
Figure 8. 2- Carrier N -CDMA ACPR, IM3, Power
Gain, Drain Efficiency versus Output Power
IM3 (dBc), ACPR (dBc)
V
DD
= 28 Vdc, I
DQ
= 1400 mA
f1 = 1958.75 MHz, f2 = 1961.25 MHz
2 x N−CDMA, 2.5 MHz @ 1.2288 MHz Bandwidth
PAR = 9.8 dB @ 0.01% Probability (CCDF)
ACPR
40 −30
35 −35
30 −40
25 −45
20 −50
15 −55
10 −60
5 −65
1
220
10
6
10
9
100
Figure 9. MTTF Factor versus Junction Temperature
MTTF FACTOR (HOURS X AMPS
2
)
10
8
10
7
120 140 160 180 200
T
J
, JUNCTION TEMPERATURE (°C)
This above graph displays calculated MTTF in hours x ampere
2
drain current. Life tests at elevated temperatures have correlated to
better than ±10% of the theoretical prediction for metal failure. Divide
MTTF factor by I
D
2
for MTTF in a particular application.
η
D
η
D
, DRAIN EFFICIENCY (%), G
ps
, POWER GAIN (dB)
N-CDMA TEST SIGNAL
f, FREQUENCY (MHz)
−100
0
Figure 10. 2- Carrier N -CDMA Spectrum
−10
−20
−30
−40
−50
−60
−70
−80
−90
−ACPR in 30 kHz
Integrated BW
+ACPR in 30 kHz
Integrated BW
−IM3 in
1.2288 MHz
Integrated BW
+IM3 in
1.2288 MHz
Integrated BW
1.2288 MHz
Channel BW
61.5 4.530−1.5−3−4.5−6−7.5 7.5
(dB)

MRF5S19150HR3

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF MOSFET Transistors HV5 32W N/CDMA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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