TB67B000HG
2013-05-09
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is
required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and
circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current
and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings,
when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a
large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow
of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit
location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the
negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or
ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection
function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s)
may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly
even just one time. Utmost care is necessary in the design of board layout since the IC may be destroyed and cause
smoke or ignition by short-circuiting between outputs, air contamination faults, or faults due to improper grounding,
or by short-circuiting between contiguous pins. Specially, in the design of the output, V
BB
, U, V, W, IS1, IS2, IS3 and
GND lines which have high voltage and high current, utmost care is necessary.
[5] Die pad on surface and PGND is connected.
When using the heat sink, handle it not to short with the IC therminals. When applying the different potential with
GND level to the heat sink, insulate with die pad and the heat sink.
