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PDI1284P11DL,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
PDI1284P11_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 25 August 2008 12 of 16
NXP Semiconductors
PDI1284P11
3.3 V parallel interface transceiver/buffer
12. Package outline
Fig 10. Package outline SOT370-1 (SSOP48)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.4
0.2
2.35
2.20
0.25
0.3
0.2
0.22
0.13
16.00
15.75
7.6
7.4
0.635 1.4 0.25
10.4
10.1
1.0
0.6
1.2
1.0
0.85
0.40
8
0
o
o
0.18 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT370-1
99-12-27
03-02-19
(1)
w M
b
p
D
H
E
E
Z
e
c
v M
A
X
A
y
48
25
MO-118
24
1
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
pin 1 index
0 5 10 mm
scale
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm
SOT370-1
A
max.
2.8
PDI1284P11_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 25 August 2008 13 of 16
NXP Semiconductors
PDI1284P11
3.3 V parallel interface transceiver/buffer
Fig 11. Package outline SOT362-1 (TSSOP48)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.2
0.1
8
0
o
o
0.1
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
SOT362-1
99-12-27
03-02-19
w M
θ
A
A
1
A
2
D
L
p
Q
detail X
E
Z
e
c
L
X
(A )
3
0.25
124
48 25
y
pin 1 index
b
H
1.05
0.85
0.28
0.17
0.2
0.1
12.6
12.4
6.2
6.0
0.5 1 0.25
8.3
7.9
0.50
0.35
0.8
0.4
0.08
0.8
0.4
p
E
v M
A
A
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
A
max.
1.2
0
2.5
5 mm
scale
MO-153
PDI1284P11_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 25 August 2008 14 of 16
NXP Semiconductors
PDI1284P11
3.3 V parallel interface transceiver/buffer
13. Abbreviations
14. Revision history
Table 11. Abbreviations
Acronym Description
CDM Charged Device Model
CMOS Complementary Metal-Oxide Semiconductor
DUT Device Under Test
ECP Extended Capability Port
EPP Enhanced Parallel Port
ESD ElectroStatic Discharge
HBM Human Body Model
LSTTL Low-power Schottky Transistor-Transistor Logic
MM Machine Model
TTL Transistor-Transistor Logic
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PDI1284P11_3 20080825 Product data sheet - PDI1284P11_2
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Quick reference table removed.
• Table 7, t
PHL
: Maximum value of 20 ns replaced by 23 ns.
• Table 11: Abbreviations list added.
PDI1284P11_2 19990917 Product specification - PDI1284P11_1
PDI1284P11_1 19970915 Product specification - -
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

PDI1284P11DL,118

Mfr. #:
Buy PDI1284P11DL,118
Manufacturer:
Nexperia
Description:
Interface - Specialized 3.3V 1284 ONE CHIP
Lifecycle:
New from this manufacturer.
Delivery:
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