TLHF4600, TLHF4601
www.vishay.com
Vishay Semiconductors
Rev. 2.0, 14-Oct-14
1
Document Number: 83134
For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Intensity LED in Ø 3 mm Tinted Diffused Package
DESCRIPTION
This device has been designed to meet the increasing
demand for AlInGaP technology general indicating and
lighting purposes.
It is housed in a 3 mm diffused plastic package. The wide
viewing angle of these devices provides a high brightness.
All packing units are categorized in luminous intensity and
color groups. That allows users to assemble LEDs with
uniform appearance.
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
•Package: 3 mm
• Product series: standard
• Angle of half intensity: ± 60°
FEATURES
• AlInGaP technology
• Standard Ø 3 mm (T-1) package
• Small mechanical tolerances
• Suitable for DC and high peak current
• Wide viewing angle
• Very high intensity
• Luminous intensity color categorized
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
• Status lights
•Off / on indicator
• Background illumination
• Readout lights
• Maintenance lights
•Legend light
PARTS TABLE
PART COLOR
LUMINOUS INTENSITY
(mcd)
at I
F
(mA)
WAVELENGTH
(nm)
at I
F
(mA)
FORWARD VOLTAGE
(V)
at I
F
(mA)
TECHNOLOGY
MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.
TLHF4600 Soft orange 10 26 - 10 598 605 611 10 - 2.0 2.6 20 AlInGaP on GaAs
TLHF4601 Soft orange 40 - 125 10 602 - 609 10 - 2.0 2.6 20 AlInGaP on GaAs
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 °C, unless otherwise specified)
TLHF4600, TLHF4601
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage V
R
5V
DC forward current T
amb
≤ 60 °C I
F
30 mA
Surge forward current t
p
≤ 10 μs I
FSM
0.1 A
Power dissipation T
amb
≤ 60 °C P
V
80 mW
Junction temperature T
j
100 °C
Operating temperature range T
amb
-40 to +100 °C
Storage temperature range T
stg
-55 to +100 °C
Soldering temperature t ≤ 5 s, 2 mm from body T
sd
260 °C
Thermal resistance junction/ambient R
thJA
400 K/W