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ESDA7P60-1U1M

P1-P3P4-P6P7-P9P10-P10
DocID027044 Rev 3 7/10
ESDA7P60-1U1M Recommendation on PCB assembly
10
3 Recommendation on PCB assembly
3.1 Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 14. Stencil opening dimensions
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for leads: Opening to footprint ratio is 90%.
/
7
:
Aspect Ratio
W
T
-----
1.5≥=
Aspect Area
LW×
2T L W+()
----------------------------
0.66≥=
Figure 15. Recommended stencil window
position
Figure 16. Alternative stencil window position
Recommendation on PCB assembly ESDA7P60-1U1M
8/10 DocID027044 Rev 3
3.2 Solder paste
1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste recommended.
3. Offers a high tack force to resist component displacement during PCB movement.
4. Use solder paste with fine particles: powder particle size 20-45 µm.
3.3 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3. Standard tolerance of ± 0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
3.4 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
3.5 Reflow profile
Figure 17. ST ECOPACK
®
recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement.
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DocID027044 Rev 3 9/10
ESDA7P60-1U1M Ordering information
10
4 Ordering information
Figure 18. Ordering information scheme
5 Revision history
Table 4. Ordering information
Order code Marking Weight Base qty Delivery mode
ESDA7P60 F
(1)
1. The marking can be rotated by multiples of 90° to differentiate assembly location
2.4 mg 8000 Tape and reel
(6'$ 380
(6' $UUD\
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Table 5. Document revision history
Date Revision Changes
14-Nov-2014 1 Initial release.
02-Jul-2015 2 Updated Figure 4.
14-Oct-2015 2 Updated Description and reformatted to current standard.
P1-P3P4-P6P7-P9P10-P10

ESDA7P60-1U1M

Mfr. #:
Buy ESDA7P60-1U1M
Manufacturer:
STMicroelectronics
Description:
TVS Diodes / ESD Suppressors High-power transient voltage suppressor (TVS)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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