Light Touch Switches/EVQPU
180
260
MAX.
150
230
90±30 40±10
(Normal Temp.)
Operation Top (°C)
Soldering Time (s)
Fan or Normal Temp.
■ Recommended Reflow Soldering Conditions
P
2
P
0
P
1
t
2
t
1
φD
0
A
B
Feeding hole
Chip component
Tape running direction
Chip pocket
F
W
E
Tape width=12.0 mm
● Embossed Carrier Taping
Unit: mm
Part No. Height ABWFEP
1
P
2
P
0
D
0
Dia. t
1
t
2
EVQPU 1.65 7.0
±0.2
5.75
±0.20 12.0±0.3
5.78
±0.20 1.75±0.10 8.0±0.1 2.0±0.1 4.0±0.1 1.5
+0.1
0.35±0.05 2.4±0.2
–0
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Panasonic Corporation
Electromechanical Control Business Division
–4–
industrial.panasonic.com/ac/e/
ANCTB23E 201703-Fd
Panasonic Corporation 2017
Taping condition : Lack of products in the middle of taping should be
one MAX, but total quantity specified in the
specifications should be secured.
Peeling off strength of top tape : It should be within 0.2N to 1.0N at
165 degree in peeling off angle.
Joint of carrier tape : One joint per one reel may exist.
201703ANCTB_E.indb 4 17/03/01 17:45
