MC100EP56DTR2G

© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. 17
1 Publication Order Number:
MC10EP56/D
MC10EP56, MC100EP56
3.3V / 5V ECL Dual
Differential 2:1 Multiplexer
Description
The MC10/100EP56 is a dual, fully differential 2:1 multiplexer. The
differential data path makes the device ideal for multiplexing low
skew clock or other skew sensitive signals. Multiple V
BB
pins are
provided.
The V
BB
pin, an internally generated voltage supply, is available to
this device only. For single−ended input conditions, the unused
differential input is connected to V
BB
as a switching reference voltage.
V
BB
may also rebias AC coupled inputs. When used, decouple V
BB
and V
CC
via a 0.01 mF capacitor and limit current sourcing or sinking
to 0.5 mA. When not used, V
BB
should be left open.
The device features both individual and common select inputs to
address both data path and random logic applications.
The 100 Series contains temperature compensation.
Features
360 ps Typical Propagation Delays
Maximum Frequency > 3 GHz Typical
PECL Mode Operating Range: V
CC
= 3.0 V to 5.5 V
with V
EE
= 0 V
NECL Mode Operating Range: V
CC
= 0 V
with V
EE
= −3.0 V to −5.5 V
Open Input Default State
Safety Clamp on Inputs
Separate and Common Select
Q Output Will Default LOW with Inputs Open or at V
EE
V
BB
Outputs
These Devices are Pb−Free and are RoHS Compliant
XXXX = MC10 or 100
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G, G = Pb−Free Package
SOIC−20
DW SUFFIX
CASE 751D
MARKING DIAGRAMS*
TSSOP−20
DT SUFFIX
CASE 948R
http://onsemi.com
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
ORDERING INFORMATION
(Note: Microdot may be in either location)
20
1
MC100EP56
AWLYYWWG
XXXX
EP56
ALYWG
G
1
20
QFN−20
MN SUFFIX
CASE 485E
XXXX
EP56
ALYWG
G
MC10EP56, MC100EP56
http://onsemi.com
2
D0b
D0b D1aV
BBO
1718 16 15 14 13 12
43
56789
Q0
11
10
SEL0
SEL1
V
CC
Q1 Q1 V
EE
D0a
1920
21
V
CC
Q0
D1aD0a
COM_SEL
V
BB1
D1bD1b
10 1 0
Table 1. PIN DESCRIPTION
PIN
D0a* − D1a*
D0a
* − D1a* ECL Input Data a Invert
FUNCTION
ECL Input Data a
D0b* − D1b*
D0b
* − D1b* ECL Input Data b Invert
ECL Input Data b
SEL0* − SEL1*
COM_SEL* ECL Common Select Input
ECL Indiv. Select Input
V
BB0
, V
BB1
Q0 − Q1 ECL True Outputs
Output Reference Voltage
Q0 − Q1 ECL Inverted Outputs
V
CC
Positive Supply
V
EE
Negative Supply
SEL0
X
L
L
H
H
Table 2. TRUTH TABLE
Q0,
Q0
a
b
b
a
a
SEL1
X
L
H
H
L
COM_SEL
H
L
L
L
L
Q1,
Q1
a
b
a
a
b
Warning: All V
CC
and V
EE
pins must be externally connected
to Power Supply to guarantee proper operation.
Figure 1. 20−Lead Package (Top View) and Logic Diagram
* Pins will default LOW when left open.
EP Exposed Pad
1
2
3
4
5
15
14
13
12
11
678910
20 19 18 17 16
Figure 1. QFN−20 Pinout (Top View)
Q0
SEL0
COM_SEL
D0a
Q0V
CC
SEL1
V
CC
Q1
Q1
V
EE
D0b
D0b
D1a
D0a
V
BB0
D1a
V
BB1
D1b D1b
Exposed Pad
NOTE: The Exposed Pad (EP) on package bottom must be attached to a heat−sinking conduit.
The Exposed Pad may only be electrically connected to V
EE
.
MC10/100EP56
MC10EP56, MC100EP56
http://onsemi.com
3
Table 3. ATTRIBUTES
Characteristics Value Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor N/A
ESD Protection Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 150 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg Pb−Free Pkg
SOIC
TSSOP
QFN
Level 1
Level 1
N/A
Level 3
Level 3
Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Transistor Count 140 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
PECL Mode Power Supply V
EE
= 0 V 6 V
V
EE
NECL Mode Power Supply V
CC
= 0 V −6 V
V
I
PECL Mode Input Voltage
NECL Mode Input Voltage
V
EE
= 0 V
V
CC
= 0 V
V
I
V
CC
V
I
V
EE
6
−6
V
V
I
out
Output Current Continuous
Surge
50
100
mA
mA
I
BB
V
BB
Sink/Source ± 0.5 mA
T
A
Operating Temperature Range −40 to +85 °C
T
stg
Storage Temperature Range −65 to +150 °C
q
JA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
20 TSSOP
20 TSSOP
140
100
°C/W
°C/W
q
JC
Thermal Resistance (Junction−to−Case) Standard Board 20 TSSOP 23 to 41 °C/W
q
JA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
20 SOIC
20 SOIC
90
60
°C/W
°C/W
q
JC
Thermal Resistance (Junction−to−Case) Standard Board 20 SOIC 33 to 35 °C/W
q
JA
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
QFN−20
QFN−20
47
33
°C/W
°C/W
q
JC
Thermal Resistance (Junction−to−Case) Standard Board QFN−20 18 °C/W
T
sol
Wave Solder Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.

MC100EP56DTR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Encoders, Decoders, Multiplexers & Demultiplexers 3.3V/5V ECL Dual Diff 2:1 Mux
Lifecycle:
New from this manufacturer.
Delivery:
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