DOCUMENT NUMBER:
98AON04475D
PAGE 2 OF 2
ISSUE REVISION DATE
O RELEASED FOR PRODUCTION. REQ BY R. FORNESS 19 MAR 2001
A CHANGED DIM “P” TO 0.23 MM MIN, 0.34 MM MAX AND 0.010 IN MIN, 0.013 IN
MAX. REQ BY J. MILLER
25 JUN 2003
B ADDED SOLDERING FOOTPRINT. REQ. BY D. TRUHITTE. 13 APR 2006
C MODIFIED SOLDERING FOOTPRINT. REQ. BY B. BECKER. 23 MAR 2015
D MODIFIED DIMENSION A MIN VALUE AND DIMENSION C MAX VALUE FOR MM.
REQ. BY R. AVILA.
15 JUL 2015
© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. D
Case Outline Number
49
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