SiRA58ADP
www.vishay.com
Vishay Siliconix
S18-0575-Rev. A, 11-Jun-2018
1
Document Number: 76684
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
N-Channel 40 V (D-S) MOSFET
FEATURES
• TrenchFET
®
Gen IV power MOSFET
• 100 % R
g
and UIS tested
•Q
gd
/ Q
gs
ratio < 1 optimizes switching
characteristics
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Synchronous rectification
• High power density DC/DC
• DC/AC inverters
Notes
a. T
C
= 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257
). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 70 °C/W
PRODUCT SUMMARY
V
DS
(V) 40
R
DS(on)
max. () at V
GS
= 10 V 0.00265
R
DS(on)
max. () at V
GS
= 4.5 V 0.00395
Q
g
typ. (nC) 18.5
I
D
(A)
a
109
Configuration Single
PowerPAK
®
SO-8 Single
Top View
1
6.15 mm
5.15 mm
Bottom View
4
G
3
S
2
S
1
S
D
8
D
6
D
7
D
5
N-Channel MOSFET
G
D
S
ORDERING INFORMATION
Package PowerPAK SO-8
Lead (Pb)-free and halogen-free SiRA58ADP-T1-RE3
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage V
DS
40
V
Gate-source voltage V
GS
+20, -16
Continuous drain current (T
J
= 150 °C)
T
C
= 25 °C
I
D
109
A
T
C
= 70 °C 87.3
T
A
= 25 °C 32.3
b, c
T
A
= 70 °C 25.9
b, c
Pulsed drain current (t = 100 μs) I
DM
150
Continuous source-drain diode current
T
C
= 25 °C
I
S
51.6
T
A
= 25 °C 4.5
b, c
Single pulse avalanche current
L = 0.1 mH
I
AS
30
Single pulse avalanche energy E
AS
45 mJ
Maximum power dissipation
T
C
= 25 °C
P
D
56.8
W
T
C
= 70 °C 36.3
T
A
= 25 °C 5
b, c
T
A
= 70 °C 3.2
b, c
Operating junction and storage temperature range T
J
, T
stg
-55 to +150
°C
Soldering recommendations (peak temperature)
d, e
260
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYPICAL MAXIMUM UNIT
Maximum junction-to-ambient
b, f
t 10 s R
thJA
20 25
°C/W
Maximum junction-to-case (drain) Steady state R
thJC
1.7 2.2