NUF2450
www.onsemi.com
3
PACKAGE DIMENSIONS
UDFN8, 1.8x1.2, 0.4P
CASE 517AD
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
E
D
D2
E2
BOTTOM VIEW
b
e
8X
0.10 B
0.05
AC
C
K8X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
8X
A
A1
(A3)
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
L
8X
1
8
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 1.80 BSC
D2 0.90 1.10
E 1.20 BSC
E2 0.20 0.30
e 0.40 BSC
L 0.20 0.30
DETAIL B
1.10
0.25
0.35
7X
0.35
1.50
0.40 PITCH
DIMENSIONS: MILLIMETERS
0.45
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1
PACKAGE
OUTLINE
J 0.19 REF
L1 −−− 0.10
8X
A1
A3
DETAIL B
MOLD CMPD
EXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL A
0.05 MIN
(0.10)
DETAIL A
OPTIONAL
CONSTRUCTION
L1
L
DETAIL A
NOTE 4
J
e/2
K 0.20 TYP
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