IXYS reserves the right to change limits, test conditions, and dimensions.
IXTA130N10T
IXTP130N10T
Symbol Test Conditions Characteristic Values
(T
J
= 25°C unless otherwise specified) Min. Typ. Max.
g
fs
V
DS
= 10V, I
D
= 60A, Note 1 55 93 S
C
iss
5080 pF
C
oss
V
GS
= 0V, V
DS
= 25V, f = 1MHz 635 pF
C
rss
95 pF
t
d(on)
Resistive Switching Times 30 ns
t
r
V
GS
= 10V, V
DS
= 0.5 • V
DSS
, I
D
= 25A 47 ns
t
d(off)
R
G
= 5Ω (External) 44 ns
t
f
28 ns
Q
g(on)
104 nC
Q
gs
V
GS
= 10V, V
DS
= 0.5 • V
DSS
, I
D
= 25A 30 nC
Q
gd
29 nC
R
thJC
0.42 °C/W
R
thCH
TO-220 0.50 °C/W
Source-Drain Diode
Symbol Test Conditions Characteristic Values
T
J
= 25°C unless otherwise specified) Min. Typ. Max.
I
S
V
GS
= 0V 130 A
I
SM
Pulse width limited by T
JM
350 A
V
SD
I
F
= 25A, V
GS
= 0V, Note 1 1.0 V
t
rr
67 ns
I
RM
4.7 A
Q
rr
160 nC
Notes: 1. Pulse test, t ≤ 300 μs; duty cycle, d ≤ 2%.
2. On through-hole packages, R
DS(on)
Kelvin test contact
location must be 5 mm or less from the package body.
TO-263 (IXTA) Outline
Pins: 1 - Gate 2 - Drain
3 - Source 4, TAB - Drain
Pins: 1 - Gate 2 - Drain
3 - Source 4, TAB - Drain
TO-220 (IXTP) Outline
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or moreof the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.06 4.83 .160 .190
A1 2.03 2.79 .080 .110
b 0.51 0.99 .020 .039
b2 1.14 1.40 .045 .055
c 0.46 0.74 .018 .029
c2 1.14 1.40 .045 .055
D 8.64 9.65 .340 .380
D1 7.11 8.13 .280 .320
E 9.65 10.29 .380 .405
E1 6.86 8.13 .270 .320
e 2.54 BSC .100 BSC
L 14.61 15.88 .575 .625
L1 2.29 2.79 .090 .110
L2 1.02 1.40 .040 .055
L3 1.27 1.78 .050 .070
L4 0 0.38 0 .015
R 0.46 0.74 .018 .029
I
F
= 0.5 • I
S
, -di/dt = 100A/μs
V
R
= 0.5 • V
DSS
, V
GS
= 0V