Reliability Report: MAX8796.pdf
Show FIT data for:
MAX8796
Request Reliability Report for:
MAX8797
Product Change Notices
Device Issue Date Area Product Change Notice
MAX8796GTJ+ 2011-11-29
2010-11-29
2010-10-06
2010-09-28
WAFER FAB
ASSEMBLY
WAFER FAB
ASSEMBLY
Product Change Notice 873 (PDF, 112.2kB)
Product Change Notice 831 (PDF, 46.5kB)
Product Change Notice 813 (PDF, 432.9kB)
Product Change Notice 799 (PDF, 52.3kB)
MAX8796GTJ+T 2011-11-29
2011-08-31
2010-11-29
2010-10-06
2010-09-28
WAFER FAB
WAFER FAB
ASSEMBLY
WAFER FAB
ASSEMBLY
Product Change Notice 873 (PDF, 112.2kB)
Product Change Notice 958_PRE-PCN
Product Change Notice 831 (PDF, 46.5kB)
Product Change Notice 813 (PDF, 432.9kB)
Product Change Notice 799 (PDF, 52.3kB)
MAX8796GTJ+TC8V 2011-11-29
2010-11-29
2010-10-06
2010-09-28
WAFER FAB
ASSEMBLY
WAFER FAB
ASSEMBLY
Product Change Notice 873 (PDF, 112.2kB)
Product Change Notice 831 (PDF, 46.5kB)
Product Change Notice 813 (PDF, 432.9kB)
Product Change Notice 799 (PDF, 52.3kB)
MAX8796GTJ+TG05 2011-11-29
2010-11-29
2010-10-06
2010-09-28
WAFER FAB
ASSEMBLY
WAFER FAB
ASSEMBLY
Product Change Notice 873 (PDF, 112.2kB)
Product Change Notice 831 (PDF, 46.5kB)
Product Change Notice 813 (PDF, 432.9kB)
Product Change Notice 799 (PDF, 52.3kB)
MAX8796GTJ+TG071 2011-11-29
2010-11-29
2010-10-06
2010-09-28
WAFER FAB
ASSEMBLY
WAFER FAB
ASSEMBLY
Product Change Notice 873 (PDF, 112.2kB)
Product Change Notice 831 (PDF, 46.5kB)
Product Change Notice 813 (PDF, 432.9kB)
Product Change Notice 799 (PDF, 52.3kB)
MAX8796GTJ+TGC1 2011-11-29
2010-11-29
2010-10-06
2010-09-28
WAFER FAB
ASSEMBLY
WAFER FAB
ASSEMBLY
Product Change Notice 873 (PDF, 112.2kB)
Product Change Notice 831 (PDF, 46.5kB)
Product Change Notice 813 (PDF, 432.9kB)
Product Change Notice 799 (PDF, 52.3kB)
MAX8797GTI+ 2011-11-29
2010-11-29
2010-10-06
2010-03-26
WAFER FAB
ASSEMBLY
WAFER FAB
ASSEMBLY
Product Change Notice 873 (PDF, 112.2kB)
Product Change Notice 831 (PDF, 46.5kB)
Product Change Notice 813 (PDF, 432.9kB)
Product Change Notice 737 (PDF, 282.7kB)
MAX8797GTI+T 2011-11-29
2010-11-29
2010-10-06
2010-03-26
WAFER FAB
ASSEMBLY
WAFER FAB
ASSEMBLY
Product Change Notice 873 (PDF, 112.2kB)
Product Change Notice 831 (PDF, 46.5kB)
Product Change Notice 813 (PDF, 432.9kB)
Product Change Notice 737 (PDF, 282.7kB)
Disclaimer
PCN's displayed are for notification only and are effective on the date distributed.
Software/Models
none
Ordering Information
Filters: Part Number Package:
Any
Temperature:
Any
Tape and Reel Sample
Part Number Free
Sample
Buy Status
Package:
TYPE
PINS FOOTPRINT
DRAWING
CODE/VAR *
Temp RoHS/Lead
-Free?
Materials Analysis
MAX8796EVKIT#
Custom
Order
KIT;
Land
Pattern: Not Available
See data sheet
MAX8796GTJ+
Custom
Order
TQFN;32 pin;26
mm²
Outline Drawing:21-0140 (PDF)
Land Pattern: 90-0001 (PDF)
Use pkgcode/variation: T3255+3*
-40°C to +105°C
RoHS/Lead-Free: Lead Free
Materials Analysis
TQFN;32 pin;26 mm²