NCP5661, NCV5661
www.onsemi.com
12
PACKAGE DIMENSIONS
DPAK−5, CENTER LEAD CROP
CASE 175AA
ISSUE B
6.4
0.252
0.8
0.031
10.6
0.417
5.8
0.228
SCALE 4:1
ǒ
mm
inches
Ǔ
0.34
0.013
5.36
0.217
2.2
0.086
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
D
A
K
B
R
V
S
F
L
G
5 PL
M
0.13 (0.005) T
E
C
U
J
H
−T−
SEATING
PLANE
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.235 0.245 5.97 6.22
B 0.250 0.265 6.35 6.73
C 0.086 0.094 2.19 2.38
D 0.020 0.028 0.51 0.71
E 0.018 0.023 0.46 0.58
F 0.024 0.032 0.61 0.81
G 0.180 BSC 4.56 BSC
H 0.034 0.040 0.87 1.01
J 0.018 0.023 0.46 0.58
K 0.102 0.114 2.60 2.89
L 0.045 BSC 1.14 BSC
R 0.170 0.190 4.32 4.83
S 0.025 0.040 0.63 1.01
U 0.020 −−− 0.51 −−−
V 0.035 0.050 0.89 1.27
Z 0.155 0.170 3.93 4.32
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
R1 0.185 0.210 4.70 5.33
R1
1234 5
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