SSM3J351R,LF

SSM3J351R
1
MOSFETs Silicon P-Channel MOS (U-MOS)
SSM3J351R
SSM3J351R
SSM3J351R
SSM3J351R
Start of commercial production
2016-07
1.
1.
1.
1. Applications
Applications
Applications
Applications
Power Management Switches
2.
2.
2.
2. Features
Features
Features
Features
(1) AEC-Q101 qualified (Note 1)
(2) 4 V drive
(3) Low drain-source on-resistance
: R
DS(ON)
= 107 m (typ.) (V
GS
= -10 V)
R
DS(ON)
= 122 m (typ.) (V
GS
= -4.5 V)
R
DS(ON)
= 129 m (typ.) (V
GS
= -4.0 V)
Note 1: For detail information, please contact to our sales.
3.
3.
3.
3. Packaging and Internal Circuit
Packaging and Internal Circuit
Packaging and Internal Circuit
Packaging and Internal Circuit
SOT-23F
1: Gate
2: Source
3: Drain
2017-12-27
Rev.4.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
SSM3J351R
2
4.
4.
4.
4. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
Absolute Maximum Ratings (Note) (Unless otherwise specified, T
a
a
a
a
= 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Drain-source voltage
Gate-source voltage
Drain current (DC)
Drain current (pulsed)
Power dissipation
Power dissipation
Single-pulse avalanche energy
Avalanche current
Channel temperature
Storage temperature
(t 10 s)
(Note 1)
(Note 1), (Note 2)
(Note 3)
(Note 3)
(Note 4)
Symbol
V
DSS
V
GSS
I
D
I
DP
P
D
P
D
E
AS
I
AR
T
ch
T
stg
Rating
-60
-20/+10
-3.5
-14
1
2
8.9
3.5
150
-55 to 150
Unit
V
A
W
mJ
A
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Ensure that the channel temperature does not exceed 150 .
Note 2: Pulse width (PW) 1 ms, duty 1 %
Note 3: Device mounted on a 25.4 mm × 25.4 mm × 1.6 mm FR4 glass epoxy board (Cu pad: 645 mm
2
)
Note 4: V
DD
= 25 V, T
ch
= 25 (Initial state), L = 1 mH, R
G
= 25
Note: This transistor is sensitive to electrostatic discharge and should be handled with care.
Note: The MOSFETs in this device are sensitive to electrostatic discharge. When handling this device, the worktables,
operators, soldering irons and other objects should be protected against anti-static discharge.
Note: The channel-to-ambient thermal resistance, R
th(ch-a)
, and the drain power dissipation, P
D
, vary according to
the board material, board area, board thickness and pad area. When using this device, be sure to take heat
dissipation fully into account.
2017-12-27
Rev.4.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
SSM3J351R
3
5.
5.
5.
5. Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
5.1.
5.1.
5.1.
5.1. Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
a
a
a
a
= 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Gate leakage current
Drain cut-off current
Drain-source breakdown voltage
Drain-source breakdown voltage
Gate threshold voltage
Drain-source on-resistance
Forward transfer admittance
(Note 1)
(Note 2)
(Note 2)
Symbol
I
GSS
I
DSS
V
(BR)DSS
V
(BR)DSX
V
th
R
DS(ON)
|Y
fs
|
Test Condition
V
DS
= 0 V, V
GS
= -16 V/+10 V
V
DS
= -60 V, V
GS
= 0 V
I
D
= -1 mA, V
GS
= 0 V
I
D
= -1 mA, V
GS
= 10 V
V
DS
= -10 V, I
D
= -1 mA
I
D
= -1.0 A, V
GS
= -4.0 V
I
D
= -1.0 A, V
GS
= -4.5 V
I
D
= -1.0 A, V
GS
= -10 V
V
DS
= -10 V, I
D
= -1.0 A
Min
-60
-50
-0.8
Typ.
129
122
107
6.4
Max
±10
-10
-2.0
184
164
134
Unit
µA
V
m
S
Note 1: If a reverse bias is applied between gate and source, this device enters V
(BR)DSX
mode. Note that the drain-
source breakdown voltage is lowered in this mode.
Note 2: Pulse measurement.
5.2.
5.2.
5.2.
5.2. Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
a
a
a
a
= 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time (turn-on time)
Switching time (turn-off time)
Symbol
C
iss
C
rss
C
oss
t
on
t
off
Test Condition
V
DS
= -10 V, V
GS
= 0 V,
f = 1 MHz
V
DD
= -30 V, I
D
= -1.0 A,
V
GS
= 0 to -4.5 V, R
G
= 10 ,
Duty 1 %, V
IN
: t
r
, t
f
< 5 ns,
Common source, See Chapter 5.3.
Min
Typ.
660
50
70
32
100
Max
Unit
pF
ns
5.3.
5.3.
5.3.
5.3. Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Fig.
Fig.
Fig.
Fig. 5.3.1
5.3.1
5.3.1
5.3.1 Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit Fig.
Fig.
Fig.
Fig. 5.3.2
5.3.2
5.3.2
5.3.2 Input Waveform/Output Waveform
Input Waveform/Output Waveform
Input Waveform/Output Waveform
Input Waveform/Output Waveform
5.4.
5.4.
5.4.
5.4. Gate Charge Characteristics (Unless otherwise specified, T
Gate Charge Characteristics (Unless otherwise specified, T
Gate Charge Characteristics (Unless otherwise specified, T
Gate Charge Characteristics (Unless otherwise specified, T
a
a
a
a
= 25
= 25
= 25
= 25
)
)
)
)
Characteristics
Total gate charge (gate-source plus gate-drain)
Gate-source charge 1
Gate-drain charge
Symbol
Q
g
Q
gs1
Q
gd
Test Condition
V
DD
= -48 V, I
D
= -3.5 A,
V
GS
= -10 V
Min
Typ.
15.1
0.6
3
Max
Unit
nC
2017-12-27
Rev.4.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation

SSM3J351R,LF

Mfr. #:
Manufacturer:
Toshiba
Description:
MOSFET Small-signal MOSFET ID -3.5A, -60V VDSS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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