NVMFS6B75NLWFT3G

© Semiconductor Components Industries, LLC, 2015
August, 2016 − Rev. 0
1 Publication Order Number:
NVMFS6B75NL/D
NVMFS6B75NL
Power MOSFET
100 V, 30 mW, 28 A, Single N−Channel
Features
Small Footprint (5x6 mm) for Compact Design
Low R
DS(on)
to Minimize Conduction Losses
Low Q
G
and Capacitance to Minimize Driver Losses
NVMFS6B75NLWF − Wettable Flank Option for Enhanced Optical
Inspection
AEC−Q101 Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage V
DSS
100 V
Gate−to−Source Voltage V
GS
±16 V
Continuous Drain
Current R
q
JC
(Notes 1, 2, 3)
Steady
State
T
C
= 25°C
I
D
28
A
T
C
= 100°C 19.7
Power Dissipation
R
q
JC
(Notes 1, 2)
T
C
= 25°C
P
D
56
W
T
C
= 100°C 28
Continuous Drain
Current R
q
JA
(Notes 1, 2, 3)
Steady
State
T
A
= 25°C
I
D
7.0
A
T
A
= 100°C 5.0
Power Dissipation
R
q
JA
(Notes 1 & 2)
T
A
= 25°C
P
D
3.5
W
T
A
= 100°C 1.75
Pulsed Drain Current
T
A
= 25°C, t
p
= 10 ms
I
DM
141 A
Operating Junction and Storage Temperature T
J
, T
stg
55 to
+ 175
°C
Source Current (Body Diode) I
S
43 A
Single Pulse Drain−to−Source Avalanche
Energy (I
L(pk)
= 1.7 A)
E
AS
177 mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
Junction−to−Case − Steady State
R
q
JC
2.7
°C/W
Junction−to−Ambient − Steady State (Note 2)
R
q
JA
43
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
MARKING
DIAGRAM
www.onsemi.com
6B75xx
AYWZZ
V
(BR)DSS
R
DS(ON)
MAX I
D
MAX
100 V
30 mW @ 10 V
28 A
G (4)
S (1,2,3)
N−CHANNEL MOSFET
D (5,6)
S
S
S
G
D
D
D
D
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
1
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
ORDERING INFORMATION
46 mW @ 4.5 V
6B75NL = NVMFS6B75NL
6B75LW = NVMFS6B75NLWF
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
NVMFS6B75NL
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
100 V
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V
(BR)DSS
/
T
J
62
mV/°C
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 80 V
T
J
= 25°C 10
mA
T
J
= 125°C 250
Gate−to−Source Leakage Current I
GSS
V
DS
= 0 V, V
GS
= 16 V 100 nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 250 mA
1.0 3.0 V
Threshold Temperature Coefficient V
GS(TH)
/T
J
−5.3 mV/°C
Drain−to−Source On Resistance R
DS(on)
V
GS
= 10 V
I
D
= 10 A
24.7 30
mW
V
GS
= 4.5 V 35 46
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
C
ISS
V
GS
= 0 V, f = 1 MHz, V
DS
= 25 V
740
pF
Output Capacitance C
OSS
260
Reverse Transfer Capacitance C
RSS
20
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 50 V; I
D
= 25 A 5.4
nC
V
GS
= 10 V, V
DS
= 50 V; I
D
= 25 A
11.3
Threshold Gate Charge Q
G(TH)
1.6
Gate−to−Source Charge Q
GS
3.2
Gate−to−Drain Charge Q
GD
1.5
Plateau Voltage V
GP
3.8 V
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
t
d(ON)
V
GS
= 4.5 V, V
DS
= 50 V,
I
D
= 25 A, R
G
= 2.5 W
9.1
ns
Rise Time t
r
88.3
Turn−Off Delay Time t
d(OFF)
16
Fall Time t
f
71.5
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 20 A
T
J
= 25°C 0.94 1.2
V
T
J
= 125°C 0.84
Reverse Recovery Time t
RR
V
GS
= 0 V, dIS/dt = 100 A/ms,
I
S
= 25 A
38.4
ns
Charge Time t
a
22.6
Discharge Time t
b
15.8
Reverse Recovery Charge Q
RR
40 nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
NVMFS6B75NL
www.onsemi.com
3
TYPICAL CHARACTERISTICS
Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V) V
GS
, GATE−TO−SOURCE VOLTAGE (V)
3.01.00
0
10
54210
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
V
GS
, GATE−TO−SOURCE VOLTAGE (V) I
D
, DRAIN CURRENT (A)
610753
20
22
10 15
20
50
15
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
T
J
, JUNCTION TEMPERATURE (°C) V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
15012510075250−25−50
1.0
1.2
55453525155
10K
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (mW)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (mW)
R
DS(on)
, NORMALIZED DRAIN−TO
SOURCE RESISTANCE
I
DSS
, LEAKAGE (nA)
4.5 V
V
DS
= 10 V
T
J
= 25°C
T
J
= 125°C
T
J
= −55°C
I
D
= 20 A
T
J
= 25°C
V
GS
= 4.5 V
T
J
= 25°C
V
GS
= 10 V
50
I
D
= 20 A
V
GS
= 10 V
T
J
= 85°C
T
J
= 125°C
3
26
0.6
1.4
32
5
3.6 V
2.0
0
20
10
36
1.8
2.0
20
25
2.5
3.0 V
V
GS
= 10 V
to 5 V
15
30
30
25
0.8
100
10
1
0.5 1.5
489
30
35
1.6
T
J
= 150°C
1K
100K
3.4 V
2.8 V
3.2 V
25
2.2
15
5
25
958565175
5
24
28
34
20
2.4
75
50
30
38
44
48
42
40
46
40
45

NVMFS6B75NLWFT3G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET 100V 30 MOHM T5 SINGLE S0
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union