I/O PLLs
The integer mode I/O PLLs are located in each bank of 48 I/Os. You can use the I/O
PLLs to simplify the design of external memory and high-speed LVDS interfaces.
In each I/O bank, the I/O PLLs are adjacent to the hard memory controllers and LVDS
SERDES. Because these PLLs are tightly coupled with the I/Os that need to use them,
it makes it easier to close timing.
You can use the I/O PLLs for general purpose applications in the core such as clock
network delay compensation and zero-delay buffering.
Intel Cyclone 10 GX devices support PLL-to-PLL cascading.
FPGA General Purpose I/O
Intel Cyclone 10 GX devices offer highly configurable GPIOs. Each I/O bank contains
48 general purpose I/Os and a high-efficiency hard memory controller.
The following list describes the features of the GPIOs:
• Consist of 3 V I/Os for high-voltage application and LVDS I/Os for differential
signaling
— One 3 V I/O bank that supports up to 3 V I/O standards
— LVDS I/O banks that support up to 1.8 V I/O standards
• Support a wide range of single-ended and differential I/O interfaces
• LVDS speeds up to 1.434 Gbps
• Each LVDS pair of pins has differential input and output buffers, allowing you to
configure the LVDS direction for each pair.
• Programmable bus hold and weak pull-up
• Programmable differential output voltage (V
OD
) and programmable pre-emphasis
• Series (R
S
) and parallel (R
T
) on-chip termination (OCT) for all I/O banks with OCT
calibration to limit the termination impedance variation
• On-chip dynamic termination that has the ability to swap between series and
parallel termination, depending on whether there is read or write on a common
bus for signal integrity
• Easy timing closure support using the hard read FIFO in the input register path,
and delay-locked loop (DLL) delay chain with fine and coarse architecture
Related Information
I/O and Differential I/O Buffers in Intel Cyclone 10 GX Devices, Intel Cyclone 10 GX
Core Fabric and General Purpose I/Os Handbook
Provides more information about the GPIOs in Intel Cyclone 10 GX devices.
External Memory Interface
Intel Cyclone 10 GX devices offer external memory bandwidth of up to 1×72-bit or
2×40-bit DDR3 memory interfaces running at up to 1,866 Mbps. This bandwidth
provides ease of design, lower power, and resource efficiencies of hardened high-
performance memory controllers.
Intel
®
Cyclone
®
10 GX Device Overview
C10GX51001 | 2018.07.11
Intel
®
Cyclone
®
10 GX Device Overview
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