BLM18EG221SN1D

Spec. No. JENF243A-0021N-01 P.1/8
MURATA MFG.CO., LTD.
Reference
Only
GHz Noise Suppression Chip Ferrite Bead
BLM18EG□□□□N1 Reference Specification
1. Scope
This reference specification applies to Chip Ferrite Bead BLM18EG_N Series.
2. Part Numbering
(ex.) BL
M 18 EG 601 S N 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (2)Type (3)Dimension() (4)Characteristics (5)Typical Impedance at 100MHz
(6)Performance (7)Category (8)Numbers of Circuit (9)Packaging(D:Taping / B:Bulk)
3. Rating
Customer
Part Number
MURATA
Part Number
Impedance ()
(Under Standard Testing Condition)
Rated
Current
(mA)
DC Resistance
( max. )
Remark
at 100MHz
at 1GHz
Initial
Values
Values
After
Testing
Typical
BLM18EG101TN1D
100±25% 80 min. 140 2000 0.045 0.07
For
general
use
(Thin type)
BLM18EG101TN1B
BLM18EG221TN1D
220±25% 180 min. 300 1000 0.15 0.21
BLM18EG221TN1B
BLM18EG331TN1D
330±25%
280 min. 450 500 0.21 0.30
BLM18EG331TN1B
BLM18EG391TN1D
390±25% 320 min. 520 500 0.30 0.40
BLM18EG391TN1B
BLM18EG121SN1D
120±25% 90 min. 145 2000 0.04 0.06
For
general
use
BLM18EG121SN1B
BLM18EG221SN1D
220±25% 160 min. 260 2000 0.05 0.08
BLM18EG221SN1B
BLM18EG471SN1D
470±25%
340 min. 550 500 0.21 0.30
BLM18EG471SN1B
BLM18EG601SN1D
600±25% 450 min. 700 500 0.35 0.45
BLM18EG601SN1B
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
As for BLM18EG type,Rated Current is derated as right figure
depending on the operating temperature.
4. Style and Dimensions
Equivalent Circuit
Unit Mass (Typical value)
BLM18EGTN1 : 0.004g
BLM18EGSN1 : 0.005g
Part Number Dimension(T)
BLM18EGTN1
0.5±0.15
BLM18EGSN1
0.8±0.15 (in mm)
: Electrode
1.6±0.15
0.8±0.15
0.4±0.2
T
2A
3
2
1
85 125
0
Operating Temperature
(℃)
Resistance element becomes
dominant at high frequencies.
()
Spec. No. JENF243A-0021N-01 P.2/8
MURATA MFG.CO., LTD.
Reference
Only
5. Marking
No marking.
6. Standard Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
7. Specifications
7-1. Electrical Performance
No. Item Specification Test Method
7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz , 1GHz±1MHz
Measuring Equipment : Agilent4291A or the equivalent
Test Fixture : Agilent16192A or the equivalent
7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter
7-2. Mechanical Performance
No. Item Specification Test Method
7-2-1 Appearance and
Dimensions
Meet item 4. Visual Inspection and measured with Slide Calipers.
7-2-2 Bonding
Strength
Meet Table 1.
Table 1
It shall be soldered on the substrate.
Applying Force(F) : 10N
Applying Time : 5s±1s
Applying Direction: Parallel to the substrate.
7-23
Bending
Strength
It shall be soldered on the substrate.
Substrate: Glass-epoxy 100mm40mm1.6mm
Deflection : 2.0mm
Speed of Applying Force : 0.5mm/s
Keeping Time : 30s
7-24
Vibration It shall be soldered on the substrate.
Oscillation Frequency : 10Hz to 2000Hz to 10Hz
for 20 min
Total Amplitude 1.5mm or Acceleration 196m/s
2
whichever is smaller
Testing Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 h)
7-2-5 Resistance
to Soldering
Heat
Pre-Heating : 150°C±10°C, 60s90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270°C±5°C
Immersion Time : 10s±0.5s
Immersion and emersion rates : 25mm/s
Then measured after exposure in the room condition for
48h±4h.
7-2-6 Drop Products shall be no failure
after tested.
It shall be dropped on concrete or steel board.
Method : free fall
Height : 1m
The number of times : 10 times
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
DC
Resistance
Meet item 3.
45mm
R340
F
Deflection
45mm
Product
Pressure jig
R0.5
Substrate
Side view
Spec. No. JENF243A-0021N-01 P.3/8
MURATA MFG.CO., LTD.
Reference
Only
No. Item Specification Test Method
7-2-7 Solderability The electrodes shall be
at least 95% covered
with new solder coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150°C±10°C, 60s90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240°C±5°C
Immersion Time : 3s±1s
Immersion and emersion rates : 25mm/s
7-3. Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
7-3-1 Temperature
Cycle
Meet Table 1. 1 cycle:
1 step: -55 °C (+0 °C, -3 °C) / 30min±3min
2 step: Ordinary temp. / 3min max.
3 step: +125 °C (+3 °C, -0 °C) / 30min±3min
4 step: Ordinary temp. / 3min max.
Total of 100 cycles
Then measured after exposure in the room condition for
48h±4h.
7-3-2 Humidity Temperature : 85°C±2°C
Humidity : 80%(RH) to 85%(RH)
Time : 1000h (+48h, -0h)
Then measured after exposure in the room condition for
48h±4h.
7-3-3 Heat Life Temperature : 125°C±3°C
Applying Current : Rated Current
Time : 1000h (+48h, -0h)
Then measured after exposure in the room condition for
48h±4h.
7-3-4 Cold Resistance Temperature : -55±2°C
Time : 1000h (+48h, -0h)
Then measured after exposure in the room condition for
48h±4h.
8. Specification of Packaging
8-1. Appearance and Dimensions (8mm-wide paper tape)
Part Number
Dimension
(a)
BLM18EGTN1
0.85 max.
BLM18EGSN1
1.1 max.
(in mm)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 4mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point
The base tape and top tape have no spliced point
(4) Cavity
There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
1.5
a
Direction of feed
4.0±0.1
4.0±0.1
1.85±0.1
2.0±0.
05
3.5±
0.05
1.75±0.1
8.0±0.3
+0.1
-0
1.05±0.1

BLM18EG221SN1D

Mfr. #:
Manufacturer:
Description:
EMI Filter Beads, Chips & Arrays 220ohms GHz General Usage
Lifecycle:
New from this manufacturer.
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