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BLM18EG601SN1D

P1-P3P4-P6P7-P8
Spec. No. JENF243A-0021N-01 P.4/8
MURATA MFG.CO., LTD.
Reference
Only
8-2. Tape Strength
(1)Pull Strength
Top tape
5N min.
Bottom tape
(2)Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
Speed of Peeling off:300mm/min
8-3. Taping Condition
(1) Standard quantity per reel
Quantity per 180mm reel: 4000 pcs. / reel
(2) There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more
than 5 pitch.
(4) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number (1), RoHS marking (2), Quantity, etc)
1) « Expression of Inspection No. » □□
OOOO 
(1) (2) (3)
(1)
Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y
(△)
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
(5) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked on
a label and the label is stuck on the box.
(Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking (2), Quantity , etc)
(6) Dimensions of reel and taping (leader-tape, trailer-tape)
(in mm)
8-4. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
Top tape
Bottom tape
Base tape
165 to 180 degree
F
Empty tape
190 min.
Leader
Trailer
Top tape
2.0±0.5
13.0±0.2
21.0±0.8
180±
60±
9±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
W
D
Label
H
Spec.No.JENF243A-0021M-01 P.5/8
MURATA MFG.CO., LTD.
Reference
Only
9. ！ Caution
9-1.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
9-2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment
(4)Power plant control equipment (5)Medical equipment (6)Disaster prevention / crime prevention equipment
(7)Traffic signal equipment (8)Transportation equipment (vehicles, trains, ships, etc.)
(9)Applications of similar complexity and /or reliability requirements to the applications listed in the above
10. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
10-1. Land pattern designing
Standard land dimensions (Flow and Reflow soldering)
Soldering a b c
Flow
0.7
2.2 to 2.6
0.7
Reflow 1.8 to 2.0
(in mm)
10-2. Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux, Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 m
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150℃ max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100℃ max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration
of product quality.
a
b
Chip Ferrite Bead
Solder Resist
Pattern
c
Spec.No.JENF243A-0021M-01 P.6/8
MURATA MFG.CO., LTD.
Reference
Only
□Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C, 60s min.
Heating 250°C, 4s~6s 265°C±3°C, 5s max.
Cycle of flow 2 times 2 times
□Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C~180°C, 90s±30s
Heating above 220°C, 30s~60s above 230°C, 60s max.
Peak temperature 245°C±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
10-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max. Tip diameter: φ3mm max.
Soldering time : 3 (+1, -0) s Times : 2times max.
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite
material due to the thermal shock.
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s∼60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
250℃
265℃±3℃
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
P1-P3P4-P6P7-P8

BLM18EG601SN1D

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EMI Filter Beads, Chips & Arrays 600 OHM POWER
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