SI1926DL-T1-E3

Si1926DL
www.vishay.com
Vishay Siliconix
S14-1565-Rev. F, 04-Aug-14
1
Document Number: 73684
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Dual N-Channel 60 V (D-S) MOSFET
Marking Code: PD
Ordering Information:
Si1926DL-T1-E3 (Lead (Pb)-free)
Si1926DL-T1-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
TrenchFET
®
power MOSFET
100 % R
g
tested
ESD protected: 1800 V
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
Low power load switch
Notes
a. Based on T
C
= 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under steady state conditions is 400 °C/W.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω) MAX. I
D
(A) Q
g
(nC) TYP.
60
1.4 at V
GS
= 10 V 0.37
0.47
3 at V
GS
= 4.5 V 0.25
SOT-363
SC-70 Dual (6 leads)
Top View
1
S
1
2
G
1
3
D
2
D
1
6
G
2
5
S
2
4
Available
N-Channel MOSFET
G
1
D
1
S
1
N-Channel MOSFET
G
2
D
2
S
2
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
60
V
Gate-Source Voltage V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
0.37
A
T
C
= 70 °C 0.30
T
A
= 25 °C 0.34
b, c
T
A
= 70 °C 0.27
b, c
Pulsed Drain Current I
DM
0.65
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
0.43
T
A
= 25 °C 0.25
b, c
Maximum Power Dissipation
T
C
= 25 °C
P
D
0.51
W
T
C
= 70 °C 0.33
T
A
= 25 °C 0.30
b, c
T
A
= 70 °C 0.20
b, c
Operating Junction and Storage Temperature Range T
J
, T
stg
-55 to +150 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYPICAL MAXIMUM UNIT
Maximum Junction-to-Ambient
b, d
t 5 s R
thJA
360 415
°C/W
Maximum Junction-to-Foot (Drain) Steady State R
thJF
300 350
Si1926DL
www.vishay.com
Vishay Siliconix
S14-1565-Rev. F, 04-Aug-14
2
Document Number: 73684
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 μA 60 - - V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 μA
- 56.7 -
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
--3-
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 1 - 2.5 V
Gate-Source Leakage I
GSS
V
DS
= 0 V, V
GS
= ± 10 V - - ± 150 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 60 V, V
GS
= 0 V - - 1
μA
V
DS
= 60 V, V
GS
= 0 V, T
J
= 85 °C - - 10
On-State Drain Current
a
I
D(on)
V
DS
10 V, V
GS
= 4.5 V 0.50 - -
A
V
DS
7.5 V, V
GS
= 10 V 0.65 - -
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 0.34 A - - 1.4
Ω
V
GS
= 4.5 V, I
D
= 0.23 A - - 3
Forward Transconductance g
fs
V
DS
= 30 V, I
D
= 0.2 A - 159 - ms
Dynamic
b
Input Capacitance C
iss
V
DS
= 30 V, V
GS
= 0 V, f = 1 MHz
- 18.5 -
pFOutput Capacitance C
oss
-7.5-
Reverse Transfer Capacitance C
rss
-4.2-
Total Gate Charge Q
g
V
DS
= 30 V, V
GS
= 10 V, I
D
= 0.34 A - 0.9 1.4
nC
V
DS
= 30 V, V
GS
= 4.5 V, I
D
= 0.34 A
- 0.5 0.75
Gate-Source Charge Q
gs
-0.2-
Gate-Drain Charge Q
gd
-0.15-
Gate Resistance R
g
f = 1 MHz - 160 240 Ω
Turn-On Delay Time t
d(on)
V
DD
= 30 V, R
L
= 100 Ω,
I
D
0.3 A, V
GEN
= 10 V, R
g
= 1 Ω
-6.510
ns
Rise Time t
r
-1218
Turn-Off Delay Time t
d(off)
-1322
Fall Time t
f
-1421
Drain-Source Body Diode Characteristics
Continuous Sorce-Drain Diode Current I
S
T
C
= 25 °C - - 0.43
A
Pulse Diode Forward Current
a
I
SM
- - 0.65
Body Diode Voltage V
SD
I
S
= 0.3 A - 0.8 1.2 V
Body Diode Reverse Recovery Time t
rr
I
F
= 0.6 A, dI/dt = 100 A/μs
- 16.5 25 ns
Body Diode Reverse Recovery Charge Q
rr
-1320nC
Reverse Recovery Fall Time t
a
- 13.5 -
ns
Reverse Recovery Rise Time t
b
-3-
Si1926DL
www.vishay.com
Vishay Siliconix
S14-1565-Rev. F, 04-Aug-14
3
Document Number: 73684
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (T
A
= 25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current
Gate Charge
Transfer Characteristics Curves vs. Temperature
Capacitance
On-Resistance vs. Junction Temperature
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.0 0.5 1.0 1.5 2.0 2.5 3.0
V
GS
= 10 V thru 5 V
V
DS
- Drain-to-Source Voltage (V)
)A( tne
rruC niarD -I
D
V
GS
= 4 V
V
GS
= 3 V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
V
GS
= 4.5 V
I
D
- Drain Current (A)
V
GS
= 10 V
R
)no
(
SD
( Ωecnatsi
seR-nO -)
0
2
4
6
8
10
0.0 0.3 0.6 0.9 1.2
I
D
= 0.5 A
)V(
ega
t
loV
e
c
r
uoS
-ot
-e
taG -
Q
g
- Total Gate Charge (nC)
V
SG
V
DS
= 30 V
V
DS
= 48 V
0.0
0.1
0.2
0.3
0.4
01234
V
GS
- Gate-to-Source Voltage (V)
)
A
(
tn
err
uC
n
i
arD -I
D
T
C
= 25 °C
T
C
= - 55 °C
T
C
= 125 °C
0
8
16
24
32
0 102030405060
C
rss
V
DS
- Drain-Source Voltage (V)
)Fp(
e
cnaticapaC - C
C
oss
C
iss
0.6
0.8
1.0
1.2
1.4
1.6
- 50 - 25 0 25 50 75 100 125 150
V
GS
= 10 V, I
D
= 0.5 A
T
J
- Junction Temperature (°C)
R
)n
o
(SD
e
c
natsiseR-nO -
)dezilam
roN
(
V
GS
= 4.5 V, I
D
= 0.2 A

SI1926DL-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 60V Vds 20V Vgs SC70-6
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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