DATASHEET
LAMP
EALP03RDDGA0
6
Copyright © 2010, Everlight Americas All Rights Reserved. Release : Sep. 25. 2008
. Issue No: 1 Rev:1
www.everlightamericas.com
1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it
may break the LEDs.
Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs
are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs.
2. Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight Americas and the storage
life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with
a nitrogen atmosphere and moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can
occur.
3. Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb,
and soldering beyond the base of the tie bar is recommended.
Recommended soldering conditions:
Hand Soldering DIP Soldering
Temp. at tip of iron
300 Max. (30W Max.)
Preheat temp.
100 Max. (60 sec Max.)
Soldering time 3 sec Max. Bath temp. & time 260 Max., 5 sec Max
Distance 3mm Min.(From solder
joint to epoxy bulb)
Distance 3mm Min. (From solder
joint to epoxy bulb)
Recommended soldering profile
Preheat
laminar wave
Fluxing
