NXP Semiconductors
BAP64LX
Silicon PIN diode
BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 6.0 — 4 July 2018
4 / 10
7 Characteristics
Table 6. Characteristics
T
amb
= 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
V
F
forward voltage I
F
= 100 mA - 0.95 1.1 V
I
R
reverse current V
R
= 60 V - - 100 nA
see Figure 2; f = 1 MHz;
V
R
= 0 V - 0.48 - pF
V
R
= 1 V - 0.34 - pF
C
d
diode capacitance
V
R
= 20 V - 0.17 0.30 pF
see Figure 3; f = 100 MHz;
I
F
= 0.5 mA - 31 50
I
F
= 1 mA - 16 26
I
F
= 10 mA - 2.6 4.4
r
D
diode forward resistance
I
F
= 100 mA - 0.9 1.5 Ω
see Figure 4; V
R
= 0 V;
f = 900 MHz - 22 - dB
f = 1800 MHz - 16 - dB
ISL isolation
f = 2450 MHz - 14 - dB
see Figure 5; I
F
= 0.5 mA;
f = 900 MHz - 2.15 - dB
f = 1800 MHz - 2.13 - dB
L
ins
insertion loss
f = 2450 MHz - 2.14 - dB
see Figure 5; I
F
= 1 mA;
f = 900 MHz - 1.21 - dB
f = 1800 MHz - 1.21 - dB
L
ins
insertion loss
f = 2450 MHz - 1.22 - dB
see Figure 5; I
F
= 10 mA;
f = 900 MHz - 0.22 - dB
f = 1800 MHz - 0.23 - dB
L
ins
insertion loss
f = 2450 MHz - 0.24 - dB
see Figure 5; I
F
= 100 mA;
f = 900 MHz - 0.09 - dB
f = 1800 MHz - 0.1 - dB
L
ins
insertion loss
f = 2450 MHz - 0.11 - dB
T
L
charge carrier life time when switched from I
F
= 10 mA to I
R
=
6 mA; R
L
= 100 Ω; measured at I
R
= 3
mA
- 1.0 - µs
NXP Semiconductors
BAP64LX
Silicon PIN diode
BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 6.0 — 4 July 2018
5 / 10
Symbol Parameter Conditions Min Typ Max Unit
L
S
series inductance I
F
= 100 mA; f = 100 MHz - 0.4 - nH
7.1 Graphics
001aag637
V
R
(V)
0 20168 124
200
300
100
400
500
C
d
(fF)
0
f = 1 MHz; T
j
= 25 °C.
Figure 2. Diode capacitance as a function of reverse
voltage; typical values
001aag638
I
F
(mA)
10
- 1
10
2
101
10
1
10
2
r
D
(Ω)
10
- 1
f = 100 MHz; T
j
= 25 °C.
Figure 3. Forward resistance as a function of forward
current; typical values
001aag639
f (MHz)
500 300025001500 20001000
- 20
- 10
0
ISL
(dB)
- 30
T
amb
= 25 °C
Diode zero biased and inserted in series with a 50 Ω
stripline circuit
Figure 4. Isolation of the diode as a function of
frequency; typical values
001aag640
f (MHz)
500 300025001500 20001000
-1.5
-1.0
-2.0
-0.5
0
L
ins
(dB)
-2.5
(1)
(2)
(3)
(4)
T
amb
= 25 °C
1. I
F
= 100 mA
2. I
F
= 10 mA
3. I
F
= 1 mA
4. I
F
= 0.5 mA
Diode inserted in series with a 50 Ω stripline circuit and
biased via the analyzer Tee network
Figure 5. >Insertion loss of the diode as a function of
frequency; typical values
NXP Semiconductors
BAP64LX
Silicon PIN diode
BAP64LX All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 6.0 — 4 July 2018
6 / 10
8 Package outline
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOD882D
sod882d_po
10-09-27
12-05-01
Unit
mm
max
nom
min
0.4 0.04 0.65
0.60
0.55
1.05
1.00
0.95
0.65
0.30
0.25
0.22
0.03
A
(1)
Dimensions
Note
1. Dimension including plating thickness.
2. The marking bar indicates the cathode (if applicable).
DFN1006D-2: Leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm SOD882D
A
1
b
0.55
0.50
0.45
D E e L
1
w
0.1
y
0 0.5 1 mm
scale
A
1
A
y
1 2
b
(2x)
L
1
(2x)
e
w A
(2x)
w B
(2x)
D
E A
B
(2)
Figure 6. Package outline SOD882D (DFN1006D-2)

BAP64LX,315

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
PIN Diodes RF Pin Diode
Lifecycle:
New from this manufacturer.
Delivery:
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