DMMT3906
MATCHED PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Intrinsically
Matched PNP Pair (Note 1)
• Small Surface Mount Package
• 2% h
FE
Matched Tolerance
• Lead
Free/RoHS Compliant (Note 3)
• "Gree
n" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-26
• Case Material:
Molded Plastic, "Green" Molding
Compound, Note 5. UL Flammability Classification
Rating 94V-0
• Terminal Conn
ections: See Diagram
• Terminals: Solderable per MI
L-STD-202, Method 208
• Lead Fr
ee Plating (Matte Tin Finish annealed over
Copper leadframe).
• Marking Informat
ion: See Page 3
• Orde
ring Information: See Page 3
• Weight: 0.015 gr
ams (approximate)
SOT-26
Dim Min Max Typ
A 0.35 0.50 0.38
B 1.50 1.70 1.60
C 2.70 3.00 2.80
D
⎯ ⎯
0.95
F
⎯ ⎯
0.55
H 2.90 3.10 3.00
J 0.013 0.10 0.05
K 1.00 1.30 1.10
L 0.35 0.55 0.40
M 0.10 0.20 0.15
All Dimens ons in mm i
A
M
J
L
FD
B
C
H
K
C
1
C
2
E
1
NC
E
2
B
1,2
Maximum Ratings @T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage
V
CBO
-40 V
Collector-Emitter Voltage
V
CEO
-40 V
Emitter-Base Voltage
V
EBO
-5.0 V
Collector Current - Continuous
I
C
-200 mA
Power Dissipation (Note 2)
P
d
225 mW
Thermal Resistance, Junction to Ambient (Note 2)
R
θ
JA
556
°C/W
Operating and Storage Temperature Range
T
j
, T
STG
-55 to +150
°C
Notes: 1. Built with adjacent die from a single wafer.
2. Device mounted on FR5 PCB: 1.0 x 0.75 x 0.62 in.; pad layout as shown on suggested pad layout document AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30293 Rev. 6 - 2 1 of 4
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DMMT3906
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