MP33AB01H Datasheet MP33AB01H, MP33AB01HTR | P10-P12

Package mechanical data MP33AB01H

10/13 DocID024171 Rev 3

Figure 6. Device footprint and PCB land pattern

d 0.150 0.0059

K 0.050 0.0020

Table 7. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package dimensions (continued)

Symbol

mm. inch.

Min. Typ. Max. Min. Typ. Max.

DocID024171 Rev 3 11/13

MP33AB01H Package mechanical data

Figure 7. Recommended stencil openings

Revision history MP33AB01H

12/13 DocID024171 Rev 3

6 Revision history

Table 8. Document revision history

Date Revision Changes

17-Jan-2013 1 Initial release

13-Sep-2013 2 Modified Figure 3 on page 7

10-Oct-2013 3 Modified description value in cover page from 63 dB to 66 dB

Mfr. #:

Manufacturer:

STMicroelectronics

Description:

IC MEMS LP MICROPHONE RHLGA

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

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