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LCB110

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R09
LCB110
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
On-Resistance (:)
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
AC/DC Configuration
DC Configuration
Typical On-Resistance
vs. Temperature
(I
L
=120mA
DC
)
Temperature (ºC)
Turn-On Time (ms)
-40
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Typical Turn-On Time
vs. Temperature
(I
F
=5mA, I
L
=120mA
DC
)
Temperature (ºC)
Turn-Off Time (ms)
-40
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
-20 0 20 40 60 80 100
I
F
=10mA
Typical Turn-Off Time
vs. Temperature
(I
L
=120mA
DC
)
Temperature (ºC)
I
F
=5mA
On-Resistance (:)
-40
50
45
40
35
30
25
20
15
10
5
0
-20 0 20 40 60 80 100
Instantaneous
Typical On-Resistance
vs. Temperature
(I
L
=100mA)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=120mA
DC
)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=120mA
DC
)
Load Current (mA)
220
200
180
160
140
120
100
80
60
40
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
DC Configuration
AC/DC Configuration
Maximum Load Current
vs. Temperature
(I
F
=0mA)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-4 -3 -2 -1 1 2 3
0
4
Typical Load Current
vs. Load Voltage
Blocking Voltage (V
P
)
-40
400
395
390
385
380
375
370
365
-20 0 20 40 60 80 100
Temperature (ºC)
Typical Blocking Voltage
vs. Temperature
(I
F
=5mA)
Leakage (PA)
-40
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 4&6
(I
F
=5mA, V
L
=350V)
Temperature (ºC)
Time
Load Current (A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 1ms 100ms 10s100Ps 10ms 1s 100s
Energy Rating Curve
I
NTEGRATED
C
IRCUITS
D
IVISION
LCB110
www.ixysic.com
5
R09
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LCB110 / LCB110S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LCB110 / LCB110S 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
6
R09
LCB110
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015)
2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
LCB110
LCB110S
MECHANICAL DIMENSIONS
P1-P3P4-P6P7-P7

LCB110

Mfr. #:
Buy LCB110
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount SPST-NC 6 Pin DIP 350V 120mA
Lifecycle:
New from this manufacturer.
Delivery:
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