RCG0603100RFKEA

RCG e3
www.vishay.com
Vishay Draloric
Revision: 01-Sep-14
4
Document Number: 20047
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
STABILITY CLASS 1
OR BETTER
STABILITY CLASS 2
OR BETTER
RCG e3 1 to 10 M 1 to 10 M
4.5 - Resistance - ± 0.5 %, ± 1 % ± 5 %
4.7 - Voltage proof U = 1.4 x U
ins
; 60 s No flashover or breakdown
4.13 - Short time overload
U = 2.5 x 2 x U
max.;
Duration acc. to style
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.17.2 58 (Td) Solderability
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) °C
(3 ± 0.3) s
Good tinning ( 95 % covered)
no visible damage
4.8.4.2 -
Temperature
coefficient
(20/- 55/20) °C and
(20/125/20) °C
± 100 ppm/K, ± 150 ppm/K ± 200 ppm/K
4.32 21 (Uu
3
)
Shear
(adhesion)
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
No visible damage
4.33 21 (Uu
1
) Substrate bending
Depth 2 mm;
3 times
No visible damage, no open circuit in bent position
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.23 - Climatic sequence: -
± (1 % R + 0.05 (2 % R + 0.1 )
4.23.2 2 (Ba) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat, cyclic
55 °C; 90 % RH;
24 h; 1 cycle
4.23.4 1 (Aa) Cold - 55 °C; 2 h
4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic
55 °C; 90 % RH;
24 h; 5 cycles
4.23.7 - DC load U =
4.25.1 - Endurance at 70 °C
U = U
max.;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (1 % R + 0.05 (2 % R + 0.1 )
4.18.2 58 (Td)
Resistance to
soldering heat
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.35 -
Flamability,
needle flame test
IEC 60695-11-5;
10 s
No burning after 30 s
4.24 78 (Cab)
Damp heat,
steady state
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
± (1 % R + 0.05 (1 % R + 0.1 )
4.25.3 -
Endurance at
upper category
temperature
155 °C, 1000 h ± (1 % R + 0.05 (2 % R + 0.1 )
4.40 -
Electrostatic
discharge
(human body model)
IEC 61340-3-1;
3 pos. + 3 neg. discharges;
ESD test voltage acc. to size
± (1 % R + 0.05 )
P
70
x R
P
70
x R
P
70
x R
RCG e3
www.vishay.com
Vishay Draloric
Revision: 01-Sep-14
5
Document Number: 20047
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
All tests are carried out in accordance with the following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-802, detail specification
IEC 60068-2, environmental test procedures
Packaging of components is done in paper tapes according to IEC 60286-3.
4.29 45 (XA)
Component solvent
resistance
Isopropyl alcohol;
50 °C; method 2
No visible damage
4.30 45 (XA)
Solvent resistance
of marking
Isopropyl alcohol;
50 °C; method 1,
toothbrush
Marking legible,
no visible damage
4.22 6 (Fc)
Vibration, endurance
by sweeping
f = 10 Hz to 2000 Hz;
x, y, z 1.5 mm;
A 200 m/s
2
;
10 sweeps per axis
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
4.37 -
Periodic electric
overload
U =
2 x U
max.;
0.1 s on; 2.5 s off;
1000 cycles
± (1 % R + 0.05 )
4.27 -
Single pulse high
voltage overload,
10 μs/700 μs
Û = 10 x
2 x U
max.;
10 pulses
± (1 % R + 0.05 )
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
STABILITY CLASS 1
OR BETTER
STABILITY CLASS 2
OR BETTER
RCG e3 1 to 10 M 1 to 10 M
15 x P
70
x R
P
70
x R
Legal Disclaimer Notice
www.vishay.com
Vishay
Revision: 08-Feb-17
1
Document Number: 91000
Disclaimer
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RCG0603100RFKEA

Mfr. #:
Manufacturer:
Vishay / Dale
Description:
Thick Film Resistors - SMD .1watt 100ohms 1% 0603 100ppm
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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