A4F08QD8BNPBSE

A
A
T
T
P
P
A
A
4
4
F
F
0
0
8
8
Q
Q
D
D
8
8
B
B
N
N
P
P
B
B
S
S
E
E
Y
Y
o
o
u
u
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U
U
l
l
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M
M
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S
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!
!
2590 North First Street, San Jose, CA 95131, USA. http://www.atpinc.com
Tel. (408) 732-5000 Fax (408) 732-5055
Page 10 of 11
TIMING PARAMETER
Note:
1. Unit ’nCK’ represents one clock cycle of the input clock, counting the actual clock edges.
Parameter Symbol
DDR4-2133
Units
Min Max
Clock cycle time at CL=15, CWL=11 tCK 0.938 <1.071 ns
Internal read command to first data tAA 14.06 18 ns
ACT to internal read or write delay time tRCD 14.06 ns
PRE command period tRP 14.06 ns
ACT to ACT or REF command period tRC 47.06 ns
ACTIVE to PRECHARGE command period tRAS 33 9*tREFI ns
Average clock high pulse width tCH(avg) 0.48 0.52 tCK
Average clock low pulse width tCL(avg) 0.48 0.52 tCK
DQS,
DQS
to DQ skew, per group, per access
tDQSQ - TBD ps
DQ output hold time from DQS,
DQS
tQH TBD - tCK
DQ low-impedance time from CK,
CK
tLZ(DQ) -360 180 ps
DQ high-impedance time from CK,
CK
tHZ(DQ) - 180 ps
DQS,
DQS
READ Preamble
tRPRE 0.9 TBD tCK
DQS,
DQS
differential READ Postamble
tRPST TBD TBD tCK
DQS,
DQS
output high time
tQSH 0.4 - tCK
DQS,
DQS
output low time
tQSL 0.4 - tCK
DQS,
DQS
WRITE Preamble
tWPRE 0.9 - tCK
DQS,
DQS
WRITE Postamble
tWPST TBD TBD tCK
DQS,
DQS
low-impedance time (Referenced from RL-1)
tLZ(DQS) -360 180 ps
DQS,
DQS
high-impedance time (Referenced from RL+BL/2)
tHZ(DQS) - 180 ps
DQS,
DQS
differential input low pulse width
tDQSL 0.46 0.54 tCK
DQS,
DQS
differential input high pulse width
tDQSH 0.46 0.54 tCK
DQS,
DQS
rising edge to CK,
CK
rising edge
tDQSS -0.27 0.27 tCK
DQS,
DQS
falling edge setup time to CK,
CK
rising edge
tDSS 0.18 - tCK
DQS,
DQS
falling edge hold time to CK,
CK
rising edge
tDSH 0.18 - tCK
DLL locking time tDLLK 768 - nCK
1
Internal READ Command to PRECHARGE Command delay tRTP max(4nCK,7.5ns) -
Delay from start of internal write trans-action to internal read command for different bank
group
tWTR_S max(2nCK,2.5ns) -
Delay from start of internal write trans-action to internal read command for same bank group tWTR_L max(4nCK,7.5ns) -
WRITE recovery time tWR 15 - ns
Mode Register Set command cycle time tMRD 8 - nCK
1
Mode Register Set command update delay tMOD max(24nCK,15ns) -
CAS
to
CAS
command delay for same bank group
tCCD 6 - nCK
1
Auto precharge write recovery + precharge time tDAL tWR + roundup (tRP / tCK) nCK
1
Multi-Purpose Register Recovery Time tMPRR 1 - nCK
1
ACTIVE to ACTIVE command delay to same bank group for 1KB page size tRRD max(4nCK,5.3ns) -
Four activate window for 1KB page size tFAW max(20nCK,21ns) -
Command and Address setup time to CK,
CK
referenced to Vih(ac) / Vil(ac) levels
tIS(base) 80 - ps
Command and Address hold time from CK,
CK
referenced to Vih(ac) / Vil(ac) levels
tIH(base) 105 - ps
Power-up and RESET calibration time tZQinit 1024 - nCK
1
Normal operation Full calibration time tZQoper 512 - nCK
1
Normal operation short calibration time tZQCS 128 - nCK
1
Exit Reset from CKE HIGH to a valid command tXPR
max (5nCK,tRFC( min)+
10ns)
-
Exit Power Down with DLL on to any valid command; Exit Precharge Power Down with DLL
frozen to commands not requiring a locked DLL
tXP max(4nCK,6ns) -
Asynchronous RTT turn-on delay (Power-Down with DLL frozen) tAONAS 1 9 ns
Asynchronous RTT turn-off delay (Power-Down with DLL frozen) tAOFAS 1 9 ns
RTT dynamic change skew tADC 0.3 0.7 tCK
8Gb REFRESH to REFRESH OR REFRESH to ACTIVE command interval tRFC 350 - ns
Average periodic refresh interval (0°C TCASE 85 °C) tREFI 7.8 7.8 us
Average periodic refresh interval (85°C TCASE 95 °C) tREFI 3.9 3.9 us
Exit Self Refresh to commands not requiring a locked DLL tXS tRFC(min)+10ns -
Exit Self Refresh to commands requiring a locked DLL tXSDLL tDLLK(min) - nCK
1
Power Down Entry to Exit Timing tPD tCKE(min) 9*tREFI tCK
Write leveling output delay tWLO 0 9.5 ns
Write leveling output error tWLOE TBD TBD ns
A
A
T
T
P
P
A
A
4
4
F
F
0
0
8
8
Q
Q
D
D
8
8
B
B
N
N
P
P
B
B
S
S
E
E
Y
Y
o
o
u
u
r
r
U
U
l
l
t
t
i
i
m
m
a
a
t
t
e
e
M
M
e
e
m
m
o
o
r
r
y
y
S
S
o
o
l
l
u
u
t
t
i
i
o
o
n
n
!
!
2590 North First Street, San Jose, CA 95131, USA. http://www.atpinc.com
Tel. (408) 732-5000 Fax (408) 732-5055
Page 11 of 11
PHYSICAL DIMENSIONS (UNITS IN INCHES)
(Drawing not to scale)
Back
Front
Note: Tolerance on all dimensions ±0.006 inch (0.15mm) unless otherwise noted
Disclaimer:
No part of this document may be copied or reproduced in any form or by any means, or transferred to any third party,
without the prior written consent of an authorized representative of ATP Electronics (“ATP”). The information in this
document is subject to change without notice. ATP assumes no responsibility for any errors or omissions that may appear
in this document, and disclaims responsibility for any consequences resulting from the use of the information set forth
herein. ATP makes no commitments to update or to keep current information contained in this document. The
information set forth in this document is considered to be “Proprietary” and “Confidential” property owned by ATP.

A4F08QD8BNPBSE

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Manufacturer:
Description:
MODULE DDR 4 SDRAM 8GB 260SODIMM
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