IRF3315S/L
PRELIMINARY
HEXFET
®
Power MOSFET
PD - 9.1617A
Absolute Maximum Ratings
11/7/97
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 1.6
R
θJA
Junction-to-Ambient ( PCB Mounted,steady-state)** 40
Thermal Resistance
°C/W
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 21
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 15 A
I
DM
Pulsed Drain Current  84
P
D
@T
A
= 25°C Power Dissipation 3.8 W
P
D
@T
C
= 25°C Power Dissipation 94 W
Linear Derating Factor 0.63 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche Energy 350 mJ
I
AR
Avalanche Current 12 A
E
AR
Repetitive Avalanche Energy 9.4 mJ
dv/dt Peak Diode Recovery dv/dt  2.5 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
l Advanced Process Technology
l Surface Mount (IRF3315S)
l Low-profile through-hole (IRF3315L)
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
Description
V
DSS
= 150V
R
DS(on)
= 0.082
I
D
= 21A
2
D Pak
TO-262
S
D
G
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D
2
Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
2
Pak is suitable for high current applications because of
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRF3315L) is available for low-
profile applications.
IRF3315S/L
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 150 –– –– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.187 ––– V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– ––– 0.082 V
GS
= 10V, I
D
= 12A
V
GS(th)
Gate Threshold Voltage 2.0 ––– 4.0 V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 17 ––– –– S V
DS
= 50V, I
D
= 12A
––– ––– 25
µA
V
DS
= 150V, V
GS
= 0V
––– ––– 250 V
DS
= 120V, V
GS
= 0V, T
J
= 125°C
Gate-to-Source Forward Leakage ––– ––– 100 V
GS
= 20V
Gate-to-Source Reverse Leakage ––– ––– -100
nA
V
GS
= -20V
Q
g
Total Gate Charge –– –– 95 I
D
= 12A
Q
gs
Gate-to-Source Charge –– ––– 11 nC V
DS
= 120V
Q
gd
Gate-to-Drain ("Miller") Charge ––– ––– 47 V
GS
= 10V, See Fig. 6 and 13 
t
d(on)
Turn-On Delay Time ––– 9.6 ––– V
DD
= 75V
t
r
Rise Time ––– 32 ––– I
D
= 12A
t
d(off)
Turn-Off Delay Time ––– 49 ––– R
G
= 5.1
t
f
Fall Time –– 38 –– R
D
= 5.9Ω, See Fig. 10 
Between lead,
––– –––
and center of die contact
C
iss
Input Capacitance ––– 1300 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 300 ––– pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 160 ––– ƒ = 1.0MHz, See Fig. 5
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
I
GSS
ns
I
DSS
Drain-to-Source Leakage Current
nH
7.5
L
S
Internal Source Inductance
V
DD
= 25V, starting T
J
= 25°C, L = 4.9 mH
R
G
= 25, I
AS
= 12A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Notes:
I
SD
12A, di/dt 140A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Pulse width 300µs; duty cycle 2%.
Uses IRF3315 data and test conditions
** When mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.3 V T
J
= 25°C, I
S
= 43A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 174 260 ns T
J
= 25°C, I
F
= 43A
Q
rr
Reverse Recovery Charge ––– 1.2 1.7 µC di/dt = 100A/µs

t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
S
D
G
A
21
84
IRF3315S/L
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
1
10
100
0.1 1 10 100
20µs PULSE WIDTH
T = 25 C
J
°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
0.0
0.5
1.0
1.5
2.0
2.5
3.0
T , Junction Temperature( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
21A
1
10
100
0.1 1 10 100
20µs PULSE WIDTH
T = 175 C
J
°
TOP
BOTTOM
VGS
15V
10V
8.0V
7.0V
6.0V
5.5V
5.0V
4.5V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
4.5V
1
10
100
4 5 6 7 8 9 10
V = 50V
20µs PULSE WIDTH
DS
V , Gate-to-Source Voltage (V)
I , Drain-to-Source Current (A)
GS
D
T = 25 C
J
°
T = 175 C
J
°

IRF3315L

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET N-CH 150V 21A TO-262
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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