ESD5Z5.0T5G

© Semiconductor Components Industries, LLC, 2014
September, 2017 Rev. 14
1 Publication Order Number:
ESD5Z2.5T1/D
ESD5Z2.5T1G Series,
SZESD5Z2.5T1G Series
ESD Protection Diode
MicroPackaged Diodes for ESD Protection
The ESD5Z Series is designed to protect voltage sensitive
components from ESD and transient voltage events. Excellent
clamping capability, low leakage, and fast response time, make these
parts ideal for ESD protection on designs where board space is at a
premium. Because of its small size, it is suited for use in cellular
phones, portable devices, digital cameras, power supplies and many
other portable applications.
Specification Features:
Low Clamping Voltage
Small Body Outline Dimensions:
0.047 x 0.032 (1.20 mm x 0.80 mm)
Low Body Height: 0.028 (0.7 mm)
Standoff Voltage: 2.5 V 12 V
Peak Power up to 240 Watts @ 8 x 20 ms Pulse
Low Leakage
Response Time is Typically < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body Model
IEC6100042 Level 4 ESD Protection
IEC6100044 Level 4 EFT Protection
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
These Devices are PbFree and are RoHS Compliant*
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping
ORDERING INFORMATION
SOD523
CASE 502
STYLE 1
1
Cathode
2
Anode
MARKING DIAGRAM
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
DEVICE MARKING INFORMATION
www.onsemi.com
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
www.onsemi.com
XX = Specific Device Code
M = Date Code
G = PbFree Package
XX
1
2
M
G
G
(Note: Microdot may be in either location)
SZ/ESD5ZxxxT1G SOD523
PbFree
3000 /
Tape & Reel
*Date Code orientation may vary
depending upon manufacturing location.
ESD5ZxxxT5G SOD523
PbFree
8000 /
Tape & Reel
ESD5Z2.5T1G Series, SZESD5Z2.5T1G Series
www.onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
IEC 6100042 (ESD)
Contact
Air
±30
±30
kV
IEC 6100044 (EFT) 40 A
ESD Voltage
Per Human Body Model
Per Machine Model
16
400
kV
V
Total Power Dissipation on FR4 Board (Note 1) @ T
A
= 25°C °P
D
° 500 mW
Junction and Storage Temperature Range T
J
, T
stg
55 to +150 °C
Lead Solder Temperature Maximum (10 Second Duration) T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. FR4 printed circuit board, singlesided copper, mounting pad 1 cm
2
.
See Application Note AND8308/D for further description of survivability specs.
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Symbol
Parameter
I
PP
Maximum Reverse Peak Pulse Current
V
C
Clamping Voltage @ I
PP
V
RWM
Working Peak Reverse Voltage
I
R
Maximum Reverse Leakage Current @ V
RWM
V
BR
Breakdown Voltage @ I
T
I
T
Test Current
I
F
Forward Current
V
F
Forward Voltage @ I
F
P
pk
Peak Power Dissipation
C Max. Capacitance @V
R
= 0 and f = 1 MHz
*See Application Note AND8308/D for detailed explanations of
datasheet parameters.
I
PP
I
F
V
I
I
R
I
T
V
RWM
V
C
V
BR
V
F
UniDirectional
ESD5Z2.5T1G Series, SZESD5Z2.5T1G Series
www.onsemi.com
3
ELECTRICAL CHARACTERISTICS (T
A
= 25°C unless otherwise noted, V
F
= 1.1 V Max. @ I
F
= 10 mA for all types)
Device*
Device
Marking
V
RWM
(V)
I
R
(mA)
@ V
RWM
V
BR
(V)
@ I
T
(Note 2)
I
T
V
C
(V)
@ I
PP
=
5.0 A
V
C
(V) @
Max I
PP
I
PP
(A)
P
pk
(W)
C
(pF)
V
C
Max Max Min mA Typ Max Max Max Typ
Per
IEC6100042
(Note 3)
ESD5Z2.5T1G/T5G ZD 2.5 6.0 4.0 1.0 6.5 10.9 11.0 120 145
Figures 1 and 2
See Below
(Note 4)
ESD5Z3.3T1G/T5G ZE 3.3 0.05 5.0 1.0 8.4 14.1 11.2 158 105
ESD5Z5.0T1G/T5G ZF 5.0 0.05 6.2 1.0 11.6 18.6 9.4 174 80
ESD5Z6.0T1G/T5G ZG 6.0 0.01 6.8 1.0 12.4 20.5 8.8 181 70
ESD5Z7.0T1G/T5G ZH 7.0 0.01 7.5 1.0 13.5 22.7 8.8 200 65
ESD5Z12T1G/T5G ZM 12 0.01 14.1 1.0 17 25 9.6 240 55
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
* Includes SZ-prefix devices where applicable.
†Surge current waveform per Figure 5.
2. V
BR
is measured with a pulse test current I
T
at an ambient temperature of 25°C.
3. For test procedure see Figures 3 and 4 and Application Note AND8307/D.
4. ESD5Z5.0T1G shown below. Other voltages available upon request.
Figure 1. ESD Clamping Voltage Screenshot
Positive 8 kV contact per IEC 6100042
Figure 2. ESD Clamping Voltage Screenshot
Negative 8 kV contact per IEC 6100042

ESD5Z5.0T5G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
TVS Diodes / ESD Suppressors SOD-523 EUT SNGL CU
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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