MAX1982/MAX1983
Current Limit
The MAX1982/MAX1983 limit the output current to
600mA (typ) in the event of an overload or output short
circuit. The current limit prevents damage to the inter-
nal power transistor, but the device can enter thermal
shutdown if the power dissipation is great enough to
increase the die temperature above +160°C (see the
Thermal-Overload Protection
section).
Thermal-Overload Protection
Thermal-overload protection limits the power dissipa-
tion in the MAX1982/MAX1983. When the die tempera-
ture exceeds +160°C, the pass transistor turns off,
allowing the device to cool. Normal operation resumes
when the die temperature cools by 20°C. A continuous
thermal-overload condition results in a pulsed output.
For continuous operation, do not exceed a junction
temperature of +150°C.
Applications Information
Output Voltage Selection
The MAX1982 output is fixed at 1.2V. The MAX1983
provides an adjustable output (0.8V to 2.0V). Connect
ADJ to a resistive voltage-divider between OUT and
GND as shown in Figure 4. Set the output voltage using
the following equation:
Set R2 at 40kΩ and choose R1 to achieve the desired
output voltage. Set V
IN
to higher than (V
OUT
+ 400mV)
to meet the dropout voltage requirement (see the
Input/Output (Dropout) Voltage
section).
To ensure stability over the specified input voltage
range, the minimum output capacitance must be 10µF
with a maximum ESR of 35mΩ.
Operating Region and Power Dissipation
The maximum power dissipation of the MAX1982/
MAX1983 depends on the thermal resistance of the 6-pin
SOT23 package and the circuit board, the temperature
difference between the die and ambient air, and the rate
of airflow. The power dissipated in the device is:
The resulting maximum power dissipation is:
where T
J(MAX)
is the maximum junction temperature
(+150°C) and T
A
is the ambient temperature, θ
JC
is the
thermal resistance from the die junction to the package
case, and θ
CA
is the thermal resistance from the case
through the PC board, copper traces, and other materi-
als to the surrounding air. For optimum power dissipa-
tion, use a large ground plane with good thermal
contact to GND, and use wide input and output traces.
When 1 square inch of copper is connected to the
device, the maximum allowable power dissipation of a
6-pin SOT23 package is 696mW. The maximum power
dissipation is derated by 8.7mW/°C above T
A
= +70°C.
Extra copper on the PC board increases thermal mass,
and reduces thermal resistance of the board. Refer to
the MAX1982/MAX1983 EV kit for a layout example.
The MAX1982/MAX1983 deliver up to 300mA and oper-
ate with input voltages up to 5.5V, but not simultane-
ously. High output currents can only be achieved when
the input-output differential voltages are low (Figure 5).
Undervoltage Lockout (UVLO)
The undervoltage lockout (UVLO) circuit ensures that
the regulator starts up with adequate voltage for the
gate-drive circuitry to bias the internal pass transistor.
The UVLO circuitry monitors V
BIAS
P
TT
DISS MAX
J MAX A
JC CA
()
()
=
+
θθ
PI VV
D OUT IN OUT
()
VV
R
R
OUT
=+
08 1
1
2
.
Low-Voltage, Low-Dropout Linear Regulators
with External Bias Supply
10 ______________________________________________________________________________________
0.1μF
BIAS
GND
SHDN
ON
OFF
IN
OUT
PGOOD
100kΩ
10μF
10μF
4.5V TO 5.5V
1.25V TO 5.5V
1.2V
MAX1982
Figure 3. MAX1982 Typical Application Circuit
0.1μF
BIAS
GND
SHDN
ON
OFF
IN
OUT
ADJ
R2
40kΩ
10μF
4.5V TO 5.5V
1.5V TO 5.5V
1.2V
MAX1983
10μF
R1
20kΩ
Figure 4. MAX1983 Typical Application Circuit
only. The UVLO threshold is 4.2V, and V
BIAS
must
remain above this level for proper operation, regardless
of the level of V
IN
.
Input Capacitor
Bypass IN to ground with a 10µF or greater ceramic
capacitor. Bypass BIAS to ground with a 0.1µF ceramic
capacitor for normal operation in most applications.
Output Capacitor
Bypass OUT to ground with a low-ESR ceramic capaci-
tor greater than 10µF. The ESR must be less than
35mΩ. Choose an output capacitor to maintain the
required output voltage tolerance during a load step.
The change in output voltage is,
where I is the load current, C
OUT
is the output capaci-
tance, and Δt is the duration of the load step.
Noise, PSRR, and Transient Response
The MAX1982/MAX1983 operate with low-dropout volt-
age and low quiescent current in notebook computers
while maintaining good noise, transient response, and
AC rejection specifications. See the
Typical Operating
Characteristics
for a graph of Power-Supply Rejection
Ratio (PSRR) vs. Frequency. Improved supply-noise
rejection and transient response can be achieved by
increasing the values of the input and output capacitors
and use passive filtering techniques when operating
from noisy sources.
The MAX1982/MAX1983 load-transient response graphs
(see the
Typical Operating Characteristics
) show two
components of the output response: a DC shift from the
output impedance due to the load current change and
the transient response. A typical transient response for a
step change in the load current from 1mA to 300mA is
20mV. Increasing the output capacitor’s value and
decreasing the ESR attenuate the overshoot.
Input/Output (Dropout) Voltage
A regulator’s minimum input-to-output voltage differen-
tial (dropout voltage) determines the lowest usable sup-
ply voltage. In battery-powered systems, the dropout
voltage determines the useful end-of-life battery volt-
age. Because the MAX1982/MAX1983 use an N-chan-
nel pass transistor, the dropout voltage is a function of
the drain-to-source on-resistance (R
DS(ON)
= 1Ω max)
multiplied by the load current (see the
Typical
Operating Characteristics
):
PC Board Layout Guidelines
The MAX1982/MAX1983 require proper layout to
achieve the intended output power level, high efficiency,
and low noise. Proper layout involves the use of a
ground plane, appropriate component placement, and
correct routing of traces using appropriate trace widths.
1) Minimize high-current ground loops. Connect the
ground of the device, the input capacitor, and the
output capacitor together at one point.
2) To optimize performance, a ground plane is essen-
tial. Use all available copper layers in applications
where the device is located on a multilayer board.
3) Connect the input filter capacitor less than 10mm
from IN. The connecting copper trace carries large
currents and must be at least 2mm wide, preferably
5mm wide.
4) Use as much copper as necessary to increase the
thermal resistance of the device. In general, more
copper provides better heatsinking capabilities.
VVVRI
DROPOUT IN OUT DS ON OUT
==×
()
Δ
Δ
V I ESR
t
C
OUT
=+
MAX1982/MAX1983
Low-Voltage, Low-Dropout Linear Regulators
with External Bias Supply
______________________________________________________________________________________ 11
INPUT-OUTPUT DIFFERENTIAL VOLTAGE (V)
MAXIMUM OUTPUT CURRENT (mA)
54321
50
100
150
200
250
300
350
0
0
TYPICAL DROPOUT VOLTAGE LIMIT
MAXIMUM CONTINUOUS CURRENT
TYPICAL SUPPLY VOLTAGE LIMIT
T
A
= +25°C
T
J
= +150°C
T
A
= +50°C
T
A
= +70°C
Figure 5. Power Operating Region—Maximum Output Current
vs. Supply Voltage
MAX1982/MAX1983
Low-Voltage, Low-Dropout Linear Regulators
with External Bias Supply
12 ______________________________________________________________________________________
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
6SOT23 U16-1
21-0058
Chip Information
TRANSISTOR COUNT: 430
PROCESS: BiCMOS

MAX1982EUT+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
LDO Voltage Regulators Low-Voltage w/ External Bias Supply
Lifecycle:
New from this manufacturer.
Delivery:
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