CY7C1019CV33-12ZXCT

CY7C1019CV33
1 Mbit (128K x 8) Static RAM
Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600
Document #: 38-05130 Rev. *G Revised September 08, 2009
Features
Temperature Ranges
Industrial: –40°C to 85°C
Automotive-A: –40°C to 85°C
Pin and Function compatible with CY7C1019BV33
High Speed
t
AA
= 10 ns
CMOS for optimum Speed and Power
Data Retention at 2.0V
Center Power/Ground Pinout
Automatic Power Down when deselected
Easy Memory Expansion with CE
and OE Options
Available in Pb-free and non Pb-free 48-Ball VFBGA, 32-Pin
TSOP II and 400-mil SOJ Package
Functional Description
The CY7C1019CV33 is a high performance CMOS static RAM
organized as 131,072 words by 8 bits. Easy memory expansion
is provided by an active LOW Chip Enable (CE
), an active LOW
Output Enable (OE
), and tristate drivers. This device has an
automatic power down feature that significantly reduces power
consumption when deselected.
Writing to the device is accomplished by taking Chip Enable (CE
)
and Write Enable (WE
) inputs LOW. Data on the eight I/O pins
(I/O
0
through I/O
7
) is then written into the location specified on
the address pins (A
0
through A
16
).
Reading from the device is accomplished by taking Chip Enable
(CE
) and Output Enable (OE) LOW while forcing Write Enable
(WE
) HIGH. Under these conditions, the contents of the memory
location specified by the address pins will appear on the I/O pins.
The eight input/output pins (I/O
0
through I/O
7
) are placed in a
high impedance state when the device is deselected (CE
HIGH),
the outputs are disabled (OE
HIGH), or during a write operation
(CE
LOW, and WE LOW).
14
15
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
COLUMN
DECODER
ROW DECODER
SENSE AMPS
INPUT BUFFER
POWER
DOWN
WE
OE
I/O
0
I/O
1
I/O
2
I/O
3
128K x 8
ARRAY
I/O
7
I/O
6
I/O
5
I/O
4
A
0
A
11
A
13
A
12
A
A
10
CE
A
A
16
A
9
Logic Block Diagram
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CY7C1019CV33
Document #: 38-05130 Rev. *G Page 2 of 10
Selection Guide
Description
-10 (Industrial/
Auto-A)
-12 (Industrial) -15 (Industrial) Unit
Maximum Access Time 10 12 15 ns
Maximum Operating Current 80 75 70 mA
Maximum Standby Current 5 5 5 mA
Pin Configuration
Figure 1. 48-Ball VFBGA (Top View)
[1]
Figure 2. 32-Pin SOJ/TSOP II (Top View)
[1]
WE
V
CC
A
9
A
16
NC
A
4
A
2
A
1
CE
NC
I/O
0
I/O
1
A
5
A
0
NC
NC
NC
I/O
2
I/O
3
V
SS
A
10
A
3
OE
V
SS
NC
I/O
7
NC
NC
A
13
A
7
A
6
NC
V
CC
I/O
6
NC
NC
NC
I/O
4
I/O
5
A
8
A
11
A
14
A
12
A
15
NC
NC
NC
3
2
6
5
4
1
D
E
B
A
C
F
G
H
NC
1
2
3
4
5
6
7
8
9
10
11
14
19
20
24
23
22
21
25
28
27
26
12
13
29
32
31
30
16
15
17
18
A
7
A
1
A
2
A
3
CE
I/O
0
I/O
1
V
CC
A
13
A
16
A
15
OE
I/O
7
I/O
6
A
12
A
11
A
10
A
9
I/O
2
A
0
A
4
A
5
A
6
I/O
4
V
CC
I/O
5
A
8
I/O
3
WE
V
SS
A
14
V
SS
Note
1. NC pins are not connected on the die.
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CY7C1019CV33
Document #: 38-05130 Rev. *G Page 3 of 10
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied ............................................ –55°C to +125°C
Supply Voltage on V
CC
to Relative GND
[2]
.....–0.5V to +4.6V
DC Voltage Applied to Outputs
in High-Z State
[2]
.................................... –0.5V to V
CC
+ 0.5V
DC Input Voltage
[2]
................................ –0.5V to V
CC
+ 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage............................................ >2001V
(per MIL-STD-883, Method 3015)
Latch up Current...................................................... >200 mA
Operating Range
Range
Ambient
Temperature
V
CC
Commercial 0°C to +70°C 3.3V ± 10%
Industrial –40°C to +85°C 3.3V ± 10%
Automotive-A –40°C to +85°C 3.3V ± 10%
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions
–10 (Industrial/
Auto-A)
–12 (Industrial) –15 (Industrial)
Unit
Min Max Min Max Min Max.
V
OH
Output HIGH Voltage V
CC
= Min.,
I
OH
= –4.0 mA
2.4 2.4 2.4 V
V
OL
Output LOW Voltage V
CC
= Min.,
I
OL
= 8.0 mA
0.4 0.4 0.4 V
V
IH
Input HIGH Voltage 2.0 V
CC
+ 0.3 2.0 V
CC
+ 0.3 2.0 V
CC
+ 0.3 V
V
IL
Input LOW Voltage
[2]
–0.3 0.8 –0.3 0.8 –0.3 0.8 V
I
IX
Input Leakage Current GND < V
I
< V
CC
–1 +1 –1 +1 –1 +1 μA
I
OZ
Output Leakage
Current
GND < V
I
< V
CC
,
Output Disabled
–1 +1 –1 +1 –1 +1 μA
I
CC
V
CC
Operating
Supply Current
V
CC
= Max.,
I
OUT
= 0 mA,
f = f
MAX
= 1/t
RC
80 75 70 mA
I
SB1
Automatic CE
Power down Current
TTL Inputs
Max. V
CC
, CE > V
IH
V
IN
> V
IH
or
V
IN
< V
IL
, f = f
MAX
15 15 15 mA
I
SB2
Automatic CE
Power down Current
CMOS Inputs
Max. V
CC
,
CE
> V
CC
– 0.3V,
V
IN
> V
CC
– 0.3V,
or V
IN
< 0.3V, f = 0
555mA
Capacitance
[3]
Parameter Description Test Conditions Max. Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
CC
= 5.0V
8pF
C
OUT
Output Capacitance 8 pF
Notes
2. V
IL
(min.) = –2.0V for pulse durations of less than 20 ns.
3. Tested initially and after any design or process changes that may affect these parameters.
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CY7C1019CV33-12ZXCT

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
IC SRAM 1M PARALLEL 32TSOP II
Lifecycle:
New from this manufacturer.
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