Spec No. JELF243B-0002S-01 P.3/9
MURATA MFG.CO., LTD
Reference Only
7. Mechanical Performance
No. Item Specification Test Method
7.1 Shear Test Chip coil shall not be damaged
after tested as test method.
Substrate: Glass-epoxy substrate
Force: 10N
Hold Duration: 5s±1s
Applied Direction: Parallel to PCB
7.2 Bending Test Chip coil shall not be damaged
after tested as test method.
Substrate: Glass-epoxy substrate
(100mm×40mm×1.0mm)
Speed of Applying Force: 1mm / s
Deflection: 2mm
Hold Duration: 30 s
(in mm)
7.3 Vibration Appearance: No damage
Inductance Change: within ±10%
Oscillation Frequency:
10Hz to 55Hz to 10Hz for 1 min
Total Amplitude: 1.5mm
Testing Time: A period of 2 hours in each of
3 mutually perpendicular directions.
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 60s to 90s
Solder Temperature: 240°C±5°C
Immersion Time: 3s±1s
7.5 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±10%
Flux: Ethanol solution of rosin 25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150°C±10°C / 1min to 2min
Solder Temperature: 270°C±5°C
Immersion Time: 10s±1s
Then measured after exposure in the room
condition for 24h±2h.
8. Environmental Performance
It shall be soldered on the substrate.
No. Item Specification Test Method
8.1 Humidity Appearance: No damage
Inductance Change: within ±10%
Temperature: 40°C±2°C
Humidity: 90%(RH) to 95%(RH)
Time: 1000h (+48h, -0h)
Then measured after exposure in the room
condition for 24h±2h.
Land
1.0
1.0
1.0
im mm
1.2
45
R340
F
Deflection
45
Product
Pressure jig
F
Chip Coil
Substrate