FCD360N65S3R0

FCD360N65S3R0
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4
TYPICAL PERFORMANCE CHARACTERISTICS
0.2 1 10 20
0.1
1
10
50
*Notes:
1. 250 ms Pulse Test
2. T
C
= 25
o
C
I
D
, Drain Current[A]
V , DrainSource Voltage[V]
V
GS
= 10.0V
8.0V
7.0V
6.5V
6.0V
5.5V
0.1
1
10
50
55
o
C
150
o
C
*Notes:
1. V
DS
= 20V
2. 250
s Pulse Test
25
o
C
I
D
, Drain Current[A]
V
GS
, GateSource Voltage[V]
0.001
0.01
0.1
1
10
100
*Notes:
1. V
GS
= 0V
2. 250
s Pulse Test
150
o
C
I
S
, Reverse Drain Current [A]
V
SD
, Body Diode Forward Voltage [V]
25
o
C
55
o
C
0.1
0.2
0.3
0.4
0.5
0.6
*Note: T
C
= 25
o
C
V
GS
= 20V
V
GS
= 10V
R
DS(ON)
,
DrainSource OnResistance [ ]
I
D
, Drain Current [A]
0.1 1 10 100 1000
0.1
1
10
100
1000
10000
100000
C
oss
C
iss
C
iss
= C
gs
+ C
gd
(C
ds
= shorted)
C
oss
= C
ds
+ C
gd
C
rss
= C
gd
*Note:
1. V
GS
= 0V
2. f = 1MHz
C
rss
Capacitances [pF]
V
DS
, DrainSource Voltage [V]
0
2
4
6
8
10
V
DS
= 400V
V
DS
= 130V
*Note: I
D
= 5A
V
GS
, GateSource Voltage [V]
Q
g
, Total Gate Charge [nC]
DS
Figure 1. OnRegion Characteristics Figure 2. Transfer Characteristics
Figure 3. OnResistance Variation vs
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage Variation
vs. Source Current and Temperature
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
m
m
W
23456789
0 5 10 15 20 25
0.0 0.5 1.51.0
0 5 10 15 20
FCD360N65S3R0
www.onsemi.com
5
0.8
0.9
1.0
1.1
1.2
*Notes:
1. V
GS
= 0V
2. I
D
= 10mA
BV
DSS
, [Normalized]
DrainSource Breakdown Voltage
T
J
, Junction Temperature [
o
C]
50 0 50 100 150
0.0
0.5
1.0
1.5
2.0
2.5
3.0
*Notes:
1. V
GS
= 10V
2. I
D
= 5A
R
DS(on)
, [Normalized]
DrainSource OnResistance
T
J
, Junction Temperature [
o
C]
0
2
4
6
8
10
12
I
D
, Drain Current [A]
T
C
, Case Temperature [
o
C]
0.01
0.1
1
10
100
10
100
1ms
10ms
I
D
, Drain Current [A]
V , DrainSource Voltage [V]
Operation in This Area
is Limited by R
DS(on)
*Notes:
1. T
C
= 25
o
C
2. T
J
= 150
o
C
3. Single Pulse
DC
0
1
2
3
4
5
E
OSS
[J]
V
DS
, Drain to Source Voltage [V]
DS
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. OnResistance Variation
vs. Temperature
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
Figure 11. Eoss vs. Drain to Source Voltage
TYPICAL PERFORMANCE CHARACTERISTICS(Continued)
50 0 50 100 150
1 10 100 1000
25 50 75 100 125 150
0 130 260 390 520 650
ms
ms
m
FCD360N65S3R0
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6
Figure 12. Transient Thermal Response Curve
10
5
10
4
10 10 10 10 10
0.001
0.01
0.1
1
2
SINGLE PULSE
r(t), NORMALIZED EFFECTIVE TRANSIENT
THERMAL RESISTANCE
t, RECTANGULAR PULSE DURATION (sec)
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
DUTY CYCLEDESCENDING ORDER
NOTES:
21012
10
3
t
t
2
Z
q
JC
(t) = r (t) x R
q
JC
R
q
JC
= 1.5 5C/W
Peak T
J
= P
DM
x Z
q
JC
(t) + T
C
Duty Cycle, D = t
1
/ t
2
DUTY CYCLEDESCENDING ORDER
1
DM
P
t
t
2
D = 0.5
0.2
0.1
0.05
0.02
0.01

FCD360N65S3R0

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET SUPERFET3 650V 10A 360 mOhm
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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