DATASHEET
SMD B
15-13D/R6GHBHC-A01/2T
11
Copyright © 2010, Everlight All Rights Reserved. Release Date : 21-May-2013. Issue No: DSE-0005368 Rev.4
www.everlight.com
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30 or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30 or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60 5 for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
P re-heatin g
150 ~ 200°C
60~ 1 2 0se c.
A bo ve 2 17°C
60~ 150sec.
26 0°C M ax.
10 sec. M ax.
6°C /sec.M ax .
A bove2 55 °C
30 sec.M ax.
3°C /sec.M ax .
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the
soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because
the damage of the product is often started at the time of the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering
iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will
not be damaged by repairing.
