25
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72261LA/72271LA SuperSync FIFO™
16,384 x 9 and 32,768 x 9
Figure 20. Block Diagram of 32,768 x 9 and 65,536 x 9 Depth Expansion
DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)
The IDT72261LA can easily be adapted to applications requiring depths
greater than 16,384 and 32,768 for the IDT72271LA with a 9-bit bus width.
In FWFT mode, the FIFOs can be connected in series (the data outputs of one
FIFO connected to the data inputs of the next) with no external logic necessary.
The resulting configuration provides a total depth equivalent to the sum of the
depths associated with each single FIFO. Figure 22 shows a depth expansion
using two IDT72261LA/72271LA devices.
Care should be taken to select FWFT mode during Master Reset for all
FIFOs in the depth expansion configuration. The first word written to an empty
configuration will pass from one FIFO to the next ("ripple down") until it finally
appears at the outputs of the last FIFO in the chain–no read operation is
necessary but the RCLK of each FIFO must be free-running. Each time the
data word appears at the outputs of one FIFO, that device's OR line goes LOW,
enabling a write to the next FIFO in line.
For an empty expansion configuration, the amount of time it takes for OR of
the last FIFO in the chain to go LOW (i.e. valid data to appear on the last FIFO's
outputs) after a word has been written to the first FIFO is the sum of the delays
for each individual FIFO:
(N – 1)*(4*transfer clock) + 3*TRCLK
where N is the number of FIFOs in the expansion and TRCLK is the RCLK
period. Note that extra cycles should be added for the possibility that the tSKEW3
Dn
INPUT READY
WRITE ENABLE
WRITE CLOCK
WEN
WCLK
IR
DATA IN
RCLK
READ CLOCK
RCLK
REN
OE
OUTPUT ENABLE
OUTPUT READY
Qn
Dn
IR
GND
WEN
WCLK
OR
REN
OE
Qn
READ ENABLE
OR
DATA OUT
IDT
72261LA
72271LA
TRANSFER CLOCK
4671 drw 23
n
n n
FWFT/SI FWFT/SI
FWFT/SI
IDT
72261LA
72271LA
specification is not met between WCLK and transfer clock, or RCLK and transfer
clock, for the OR flag.
The "ripple down" delay is only noticeable for the first word written to an
empty depth expansion configuration. There will be no delay evident for
subsequent words written to the configuration.
The first free location created by reading from a full depth expansion
configuration will "bubble up" from the last FIFO to the previous one until it finally
moves into the first FIFO of the chain. Each time a free location is created in
one FIFO of the chain, that FIFO's IR line goes LOW, enabling the preceding
FIFO to write a word to fill it.
For a full expansion configuration, the amount of time it takes for IR of the first
FIFO in the chain to go LOW after a word has been read from the last FIFO
is the sum of the delays for each individual FIFO:
(N – 1)*(3*transfer clock) + 2 TWCLK
where N is the number of FIFOs in the expansion and TWCLK is the WCLK
period. Note that extra cycles should be added for the possibility that the
tSKEW1 specification is not met between RCLK and transfer clock, or WCLK
and transfer clock, for the IR flag.
The Transfer Clock line should be tied to either WCLK or RCLK,
whichever is faster. Both these actions result in data moving, as quickly
as possible, to the end of the chain and free locations to the beginning of
the chain.
26
CORPORATE HEADQUARTERS for SALES: for Tech Support:
6024 Silver Creek Valley Road 800-345-7015 or 408-284-8200 408-360-1753
San Jose, CA 95138 fax: 408-284-2775 email: FIFOhelp@idt.com
www.idt.com
ORDERING INFORMATION
Thin Plastic Quad Flatpack (TQFP, PN64-1)
Slim Thin Quad Flatpack (STQFP, PP64-1)
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
Low Power
16,384 x 9 — SuperSync FIFO
32,768 x 9 — SuperSync FIFO
4671 drw24
Clock Cycle Time (t
CLK
)
Speed in Nanoseconds
Com'l & Ind'l
Com‘l & Ind’l
XXXXX
Device Type
X
Power
XX
Speed
X
Package
X
Process /
Temperature
Range
BLANK
I
(1)
72261
72271
Commercial Only
LA
G
PF
TF
10
15
20
X
Green
BLANK
8
Tube or Tray
Tape and Reel
X
NOTES:
1. Industrial temperature range product for 15ns and 20ns speed grade are available as a standard device.
2. Green parts available. For specific speeds and packages contact your sales office.
DATASHEET DOCUMENT HISTORY
04/26/2001 pgs. 1, 5, 6 and 26.
10/17/2005 pgs. 1, 6, 20, 21 and 26. PCN
#
F0509-01.
01/07/2009 pg. 26.
07/25/2013 pg. 3 and 26.
27
©
2009 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice
3.3 VOLT CMOS SuperSync FIFO
16,384 x 9
32,768 x9
IDT72261LA
IDT72271LA
IDT, IDT logo are registered trademarks of Integrated Device Technology, Inc.The SuperSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
ADDENDUM
DIFFERENCES BETWEEN THE IDT72261LA/72271LA AND IDT72261L/72271L
IDT has improved the performance of the IDT72261/72271 SuperSync™ FIFOs. The new versions are designated by the “LA” mark. The LA part
is pin-for-pin compatible with the original “L” version. Some difference exist between the two versions. The following table details these differences.
Item NEW PART OLD PART Comments
IDT72261LA IDT72261L
IDT72271LA IDT72271L
Pin #3 DC (Don’t Care) - There is FS (Frequency Select) In the LA part this pin must be tied
no restriction on WCLK and to either VCC or GND and must
RCLK. See note 1. not toggle after reset.
First Word Latency 60ns
(2)
+ tREF + 1 TRCLK
(4)
tFWL
1
= 10*Tf
(3)
+ 2TRCLK
(4)
(ns) First word latency in the LA part
(IDT Standard Mode) is a fixed value, independent of
the frequency of RCLK or WCLK.
First Word Latency 60ns
(2)
+ tREF + 2 TRCLK
(4)
tFWL
2
= 10*Tf
(3)
+ 3TRCLK
(4)
(ns) First word latency in the LA part
(FWFT Mode) is a fixed value, independent of
the frequency of RCLK or WCLK.
Retransmit Latency 60ns
(2)
+ tREF + 1 TRCLK
(4)
tRTF
1
= 14*Tf
(3)
+ 3TRCLK
(4)
(ns) Retransmit latency in the LA part
(IDT Standard Mode) is a fixed value, independent of
the frequency of RCLK or WCLK.
Retransmit Latency 60ns
(2)
+ tREF + 2 TRCLK
(4)
tRTF
2
= 14*Tf
(3)
+ 4TRCLK
(4)
(ns) Retransmit latency in the LA part
(FWFT Mode) is a fixed value, independent of
the frequency of RCLK or WCLK.
ICC1 75mA 150mA Active supply current
ICC2 20mA 15mA Standby current
Typical ICC1
(5)
15 + 1.85*fS + 0.02*CL*fS(mA) Not Given Typical ICC1 Current calculation
NOTES:
1. WCLK and RCLK can vary independently and can be stopped. There is no restriction on operating WCLK and RCLK.
2. This is tSKEW3.
3. Tf is the period of the ‘selected clock’.
4. TRCLK is the cycle period of the read clock.
5. Typical ICC1 is based on VCC = 5V, tA = 25C, fS = WCLK frequency = RCLK frequency (in MHz using TTL levels), data switching at fS/2, CL = Capacitive Load (in pF).

72261LA20PF8

Mfr. #:
Manufacturer:
Description:
FIFO 16KX9 SUPER SYNC FIFO
Lifecycle:
New from this manufacturer.
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