MCW0612MC6809FP100

MCW 0406 AT, MCW 0612 AT - Professional
www.vishay.com
Vishay Beyschlag
Revision: 05-Dec-16
7
Document Number: 28796
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400),
sectional specification
EN 140401-801, detail specification
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801.The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA/ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
(1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE
(R)
Stability for product types:
MCW 0406 AT 1 to 100 k
MCW 0612 AT 10 to 100 k
4.5 - Resistance ± 1 % R; ± 0.5 % R
4.8 - Temperature coefficient
At (20 / -55 / 20) °C and
(20 / 155 / 20) °C
± 50 ppm/K; ± 25 ppm/K
4.25.1 -
Endurance at 70 °C:
standard operation mode
U = or U = U
max.
;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (0.1 % R + 0.05 )
± (0.2 % R + 0.05 )
Endurance at 70 °C:
power operation mode
U = or U = U
max.
;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (0.2 % R + 0.05 )
± (0.4 % R + 0.05 )
Endurance at 85 °C:
advanced temperature
operation mode
U = or U = U
max.
;
whichever is the less severe;
1.5 h on; 0.5 h off;
85 °C; 1000 h
± (0.4 % R + 0.05 )
4.25.3 -
Endurance at
upper category temperature
125 °C; 1000 h ± (0.15 % R + 0.02 )
155 °C; 1000 h ± (0.3 % R + 0.05 )
175 °C; 1000 h ± (0.5 % R + 0.05 )
4.24 78 (Cab) Damp heat, steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
± (0.1 % R + 0.05 )
4.37 67 (Cy)
Damp heat,
steady state,
accelerated:
standard operation mode
(85 ± 2) °C
(85 ± 5) % RH
U = ;
U 0.3 x U
max.
; 1000 h
± (0.5 % R + 0.05 )
P
70
x R
P
70
x R
P
85
x R
0.1 x P
70
x R
MCW 0406 AT, MCW 0612 AT - Professional
www.vishay.com
Vishay Beyschlag
Revision: 05-Dec-16
8
Document Number: 28796
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2)
Tested on a 4-layer printed circuit board with SAC micro alloy.
4.23
Climatic sequence:
standard operation mode:
± (0.5 % R + 0.05 )
4.23.2 2 (Bb) dry heat 155 °C; 16 h
4.23.3 30 (Db) damp heat, cyclic
55 °C; 24 h; 90 % RH;
1 cycle
4.23.4 1 (Ab) cold -55 °C; 2 h
4.23.5 13 (M) low air pressure 8.5 kPa; 2 h; (25 ± 10) °C
4.23.6 30 (Db) damp heat, cyclic
55 °C; 24 h; > 90 % RH;
5 cycles
4.23.7 - DC load U = U
max.
; 1 min
-1 (Ab)
Storage at low
temperature
-55 °C; 2 h ± (0.1 % R + 0.01 )
4.19 14 (Na)
Rapid change of
temperature
30 min at -55 °C and
30 min at 155 °C;
1000 cycles
± (0.25 % R + 0.05 )
Extended rapid change
of temperature
30 min at -40 °C and
30 min at 125 °C;
MCW 0406 AT: 3000 cycles
(2)
MCW 0612 AT: to be determined
± (0.25 % R + 0.05 )
( 50 % of initial shear force)
4.13 -
Short time overload:
standard operation mode
U = 2.5 x or
U = 2 × U
max.
;
whichever is the less severe;
5 s
± (0.1 % R + 0.01 )
Short time overload:
power operation mode
± (0.25 % R + 0.05 )
4.38 -
Electro Static Discharge
(Human Body Model)
IEC 61340-3-1
(1)
;
3 pos. + 3 neg.
(equivalent to
MIL-STD-833, method 3015)
MCW 0406 AT: 500 V
MCW 0612 AT: 1000 V
± (0.5 % R + 0.05 )
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s
2
; 7.5 h
± (0.1 % R + 0.01 )
no visible damage
4.17 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning ( 95 % covered);
no visible damage
4.18 58 (Td) Resistance to soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.1 % R + 0.02 )
no visible damage
4.29 45 (XA) Component solvent resistance
Isopropyl alcohol + 50 °C;
method 2
No visible damage
4.32 21 (Ue
3
) Shear (adhesion)
RR1016M: 9N
RR1632M: 45N
No visible damage
4.33 21 (Ue
1
) Substrate bending Depth 2 mm, 3 times
± (0.1 % R + 0.01 )
no visible damage;
no open circuit in bent position
4.7 - Voltage proof U
RMS
= U
ins
; (60 ± 5) s No flashover or breakdown
4.35 - Flammability
IEC 60695-11-5
(1)
needle flame test; 10 s
No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
(1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE
(R)
Stability for product types:
MCW 0406 AT 1 to 100 k
MCW 0612 AT 10 to 100 k
P
70
x R
P
70
x R
MCW 0406 AT, MCW 0612 AT - Professional
www.vishay.com
Vishay Beyschlag
Revision: 05-Dec-16
9
Document Number: 28796
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS
SOLDER PAD DIMENSIONS
Notes
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e. g. in standards IEC 61188-5-x
(1)
,
or in publication IPC-7351.
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
DIMENSIONS AND MASS
TYPE / SIZE
H
(mm)
L
(mm)
W
(mm)
W
T
(mm)
T
t
(mm)
T
b
(mm)
MASS
(mg)
MCW 0406 AT 0.3 ± 0.05 1.0 ± 0.15 1.5 ± 0.15 > 75 % of W 0.2 + 0.1 / - 0.15 0.2 ± 0.1 1.9
MCW 0612 AT 0.45 ± 0.15 1.6 ± 0.15 3.1 ± 0.15 > 75 % of W 0.25 ± 0.15 0.3 ± 0.15 9.0
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MCW 0406 AT 0.35 0.55 1.75 1.45
MCW 0612 AT 0.75 0.7 3.3 2.15
L
T
b
H
T
t
W
W
T
G
X
Y
Z

MCW0612MC6809FP100

Mfr. #:
Manufacturer:
Description:
Thin Film Resistors - SMD 1watt 68ohms 1% 50ppm
Lifecycle:
New from this manufacturer.
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