PMBFJ108_109_110 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 4 — 20 September 2011 2 of 9
NXP Semiconductors
PMBFJ108; PMBFJ109; PMBFJ110
N-channel junction FETs
3. Ordering information
4. Marking
[1] * = p: Made in Hong Kong
* = t: Made in Malaysia
* = W: Made in China
5. Limiting values
[1] Mounted on an FR4 printed-circuit board.
6. Thermal characteristics
[1] Mounted on an FR4 printed-circuit board.
Table 2. Ordering information
Type number Package
Name Description Version
PMBFJ108 - plastic surface mounted package; 3 leads SOT23
PMBFJ109
PMBFJ110
Table 3. Marking
Type number Marking code
[1]
PMBFJ108 38*
PMBFJ109 39*
PMBFJ110 40*
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
drain-source voltage (DC) - 25 V
V
GSO
gate-source voltage - 25 V
V
GDO
gate-drain voltage - 25 V
I
G
forward gate current (DC) - 50 mA
P
tot
total power dissipation T
amb
= 25 C
[1]
-250mW
T
stg
storage temperature 65 +150 C
T
j
junction temperature - 150 C
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-a)
thermal resistance from junction to ambient
[1]
500 K/W