Features
n RoHS compliant*
n Low profile
n Low power loss, high efficiency
n UL 94V-0 classification
Applications
n Switch Mode Power Supplies
n Portable equipment batteries
n High frequency rectification
n DC/DC Converters
n Telecommunications
CD214C-FS3x Series Fast Response Rectifier Chip Diode
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
General Information
Portable communications, computing and video equipment manufacturers are challenging the
semiconductor industry to develop increasingly smaller electronic components.
Bourns offers Glass Passivated Rectiers for rectication applications in a compact chip
package compatible with DO-214AB (SMC) size format. The Glass Passivated Rectier
Diodes offer a forward current of 3 A with a choice of repetitive peak reverse voltage of 200 V
up to 600 V.
Absolute Maximum Ratings (@ T
A
= 25 °C Unless Otherwise Noted)
Parameter Symbol
CD214C-
Unit
FS3D FS3G FS3J
Maximum Repetitive Peak Reverse Voltage V
RRM
200 400 600 V
Maximum Average Forward Current I
F(AV)
3 A
Maximum Peak Forward Surge Current
(8.3 ms Single Half Sine-Wave)
I
FSM
100 A
Operating Junction Temperature Range T
OPR
-65 to +175 °C
Storage Temperature Range T
STG
-65 to +175 °C
*RoHS COMPLIANT
LEAD FREE
*RoHS COMPLIANT
VERSIONS
AVAILABLE
LEAD FREE
VERSIONS ARE
RoHS COMPLIANT*
Electrical Characteristics (@ T
A
= 25 °C Unless Otherwise Noted)
Parameter Symbol Condition or Model Min. Typ. Max. Unit
Maximum Instantaneous Forward Voltage
(NOTE 1)
V
F
I
F
=
3 A
CD214C-FS3D 0.93 0.95
VCD214C-FS3G 1.2 1.25
CD214C-FS3J 1.4 1.7
DC Reverse Current I
R
V
R
=
V
RRM
0.2 5 µA
Reverse Recovery Time
I
F
= 0.5 A,
I
R
= 1.0 A,
I
rr
= 0.25 A
T
rr
35 nS
Typical Junction Capacitance C
J
V
R
= 4 V, f = 1.0 MHz 19 pF
Typical Thermal Resistance
(NOTE 2)
Junction to
Ambient
R
θJA
60
°C/W
Junction to
Lead
R
θJL
10
NOTES:
(1) Pulse width 300 microsecond, 1 % duty cycle.
(2) Mounted on PCB with 5.0 x 5.0 mm (0.2 x 0.2 inch) copper pad areas.
