In our continuing strategy to deliver unparalleled circuit protection solutions,
technical expertise and application leadership, we proudly introduce the
WICKMANN Group and its products to the Littelfuse portfolio.
040606
www.littelfuse.com
3.45
1.78
1.78
3.15
Dimensions (mm)
Solder pad Layout (mm)
Dimensions (mm)
SMD1812P010TS/TF 0.10 0.30 30 10/100* 1.50 @ 0.50 0.8 1.600 7.000 15.000 • •
SMD1812P014TS/TF 0.14 0.34 60 10/100* 0.15 @ 1.50 0.8 1.500 4.000 6.000 • •
SMD1812P020TS/TF 0.20 0.40 30 10/100* 0.02 @ 8.00 0.8 0.800 2.900 5.000 • •
SMD1812P050TS/TF 0.50 1.00 15 40/100* 0.15 @ 8.00 0.8 0.150 0.600 1.000 • •
SMD1812P075TS/TF 0.75 1.50 13.2 40/100* 0.20 @ 8.00 0.8 0.110 0.260 0.450 • •
SMD1812P075TS/TF/24 0.75 1.50 24 40/100* 0.20 @ 8.00 0.8 0.110 0.200 0.290 • •
SMD1812P075TF/33 0.75 1.50 33 20 0.20 @ 8.00 0.8 0.110 0.260 0.400 •
SMD1812P110TS/TF 1.10 2.20 6 40/100* 0.30 @ 8.00 0.8 0.040 0.120 0.210 • •
SMD1812P110TS/TF/16 1.10 1.95 16 40/100* 0.50 @ 8.00 0.8 0.060 0.120 0.180 • •
SMD1812P110TF/33 1.10 1.95 33 20 0.50 @ 8.00 0.8 0.060 0.120 0.200 •
SMD1812P125TS/TF 1.25 2.50 15 40/100* 0.40 @ 8.00 0.8 0.070 0.160 0.250 • •
SMD1812P150TS/TF 1.50 3.00 6 40/100* 0.50 @ 8.00 0.8 0.040 0.070 0.110 • •
SMD1812P150TF/12 1.50 3.00 12 40/100* 0.50 @ 8.00 0.8 0.040 0.070 0.110 • •
SMD1812P150TF/24 1.50 3.00 24 20 1.50 @ 8.00 0.8 0.040 0.070 0.120 p
SMD1812P160TS/TF 1.60 2.80 6 40/100* 1.00 @ 8.00 0.8 0.030 0.066 0.100 • •
SMD1812P160TS/TF/8 1.60 2.80 8 40/100* 1.00 @ 8.00 0.8 0.030 0.066 0.100 • •
SMD1812P160TF/12 1.60 2.80 12 20/100* 1.00 @ 8.00 0.8 0.030 0.066 0.100 •
SMD1812P200TS/TF 2.00 3.50 8 40/100* 2.00 @ 8.00 0.8 0.020 0.040 0.060 • •
SMD1812P260TS/TF 2.60 5.20 6 40/100* 2.50 @ 8.00 0.8 0.015 0.030 0.047 • •
cURus
TÜV
Permissible continuous operating current is ≤ 100 % at ambient temperature of 20 ºC (68 ºF).
NOTE:
I
hold
= Hold current: maximum current device will pass without tripping in 20 °C still air.
I
trip
=
Trip current: minimum current at which the device will trip in 20 °C still air.
V
max
= Maximum voltage device can withstand without damage at rated current (I
max
)
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
= Power dissipated from device when in the tripped state at 20 °C still air.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
1max
= Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
Caution: Operation beyond the specifi ed rating may result in damage and possible arcing and fl ame.
Specifi cations are subject to change without notice
* Approvals for 100 A pending
Model I
hold
I
Trip
V
max. dc
I
max.
max. time to trip P
d max.
Resistance Approvals
(A) (A) (A) (V) (A) (s @ A)
(W)
R
min.
(Ω)
R
typ.
(Ω)
R
I max.
(Ω)
Order Qty. Order- Model Packaging
Information Number
Model A B C D E packaging quantity
Min Max Min Max Min Max Min Min Max tape
SMD1812P010TS/TF 4.37 4.73 3.07 3.41 0.75 1.25 0.30 0.25 0.65
SMD1812P014TS/TF 4.37 4.73 3.07 3.41 0.75 1.95 0.30 0.25 0.65
SMD1812P020TS/TF 4.37 4.73 3.07 3.41 0.55 1.00 0.30 0.25 0.65
SMD1812P050TS/TF 4.37 4.73 3.07 3.41 0.50 0.75 0.30 0.25 0.50
SMD1812P075TS/TF 4.37 4.73 3.07 3.41 0.50 0.75 0.30 0.25 0.50
SMD1812P075TS/TF/24 4.37 4.73 3.07 3.41 0.75 1.55 0.30 0.25 0.65
SMD1812P110TS/TF 4.37 4.73 3.07 3.41 0.50 0.75 0.30 0.25 0.50
SMD1812P110TS/TF/16 4.37 4.73 3.07 3.41 0.75 1.25 0.30 0.25 0.65
SMD1812P125TS/TF 4.37 4.73 3.07 3.41 0.75 1.25 0.30 0.25 0.50
SMD1812P150TS/TF 4.37 4.73 3.07 3.41 0.75 1.25 0.30 0.25 0.50
SMD1812P150TF/12 4.37 4.73 3.07 3.41 0.75 1.25 0.30 0.25 0.65
SMD1812P160TS/TF 4.37 4.73 3.07 3.41 0.75 1.25 0.30 0.25 0.65
SMD1812P160TS/TF/8 4.37 4.73 3.07 3.41 0.75 1.25 0.30 0.25 0.65
SMD1812P200TS/TF 4.37 4.73 3.07 3.41 0.75 1.55 0.30 0.25 0.50
SMD1812P260TS/TF 4.37 4.73 3.07 3.41 1.00 1.60 0.30 0.25 0.50
1,500
1,500
2,000
2,000
2,000
1,500
2,000
1,500
1,500
1,500
1,500
1,500
1,500
1,500
1,000
*
*
* only type "TF"
POLYFUSE
®
RESETTABLE FUSES
Specifi cations
Packaging
A Blistertape and reel Ø 178 mm
Materials
Terminals: Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Lead free plating on request
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 ºC to +85 ºC (consider derating)
Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
Vibration
MIL-STD-883C, Method 2007.1, Condition A,
no change
Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Solderability
Meets EIA Specifi cation RS186-9E,
ANSI/J-STD-002, Category 3
Refl ow only
Solvent Resistance
MIL-STD-202, Method 215, no change
Marking
“P”, Part Code
SMD Type, 6 V - 60 V
Standard
UL 1434 1
st
Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
Approvals
cULus Recognition
TÜV
Features
This product line is also designed for surface-
mount applications. The products with 1812-mil
footprint range in hold currents from 0.1 A to
2.6 A and voltage from 6 V to 60 V. These devices
are suited for PC mother board, computer periph-
eral products and general electronics applications.
Suitable for refl ow soldering.
SMD1812
This product is not recommended
for new designs. Please refer to
Littelfuse No. 1812L.
Please choose TS for SnPb and TF for Sn plating
