ADA4960-1 Data Sheet
Rev. A | Page 6 of 19
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage, VCC 5.25 V
VIP, VIN VCC + 0.5 V
Internal Power Dissipation See Figure 3
Maximum Junction Temperature 150°C
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the device (including the exposed pad) soldered
to a high thermal conductivity, 4-layer circuit board, as described
in EIA/JESD 51-7.
Table 3. Thermal Resistance
Package Type θ
JA
Unit
16-Lead LFCSP (Exposed Pad) 89.5 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the ADA4960-1 package
is limited by the associated rise in junction temperature (T
J
) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the ADA4960-1. Exceeding a junction
temperature of 150°C for an extended period can result in
changes in the silicon devices, potentially causing failure.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the voltage
between the supply pins (V
S
) times the quiescent current (I
S
).
The power dissipated due to the load drive depends upon the
particular application. The power due to load drive is calculated
by multiplying the load current by the associated voltage drop
across the device. RMS voltages and currents must be used in
these calculations.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, more metal directly in contact with the package leads/
exposed pad from metal traces, through holes, ground, and power
planes reduce θ
JA
.
Figure 3 shows the maximum safe power dissipation of the
ADA4960-1 vs. the ambient temperature on a JEDEC standard
4-layer board.
2.5
2.0
1.5
1.0
0.5
0
–40 –20 0 20 40 60 80 100
AMBIENT TEMPERATURE (°C)
MAXIMUM POWER DISSIPATION
08458-002
QUIESCENT POWER
Figure 3. Maximum Power Dissipation vs. Ambient Temperature for 4-Layer Board
ESD CAUTION
