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MAX3969ETP+T

P1-P3P4-P6P7-P9P10-P11
Select C
FILTER
For SFP/SFF, FDDI, 155Mbps ATM LAN, Fast Ethernet,
and ESCON receivers, Maxim recommends C
FILTER
=
0.01µF. This capacitor value ensures chatter-free
LOS/SD and provides a typical assert/deassert time of
10µs. For other applications, the value of C
FILTER
can
be calculated using the following equation:
C
FILTER
= τ / 825Ω
where τ is the desired time constant of the power detector.
Select C
AZ
and C
IN
External-coupling capacitors (C
IN
) are required on the
data inputs for the offset correction loop to function
properly. The offset correction loop bandwidth is deter-
mined by the external capacitor (C
AZ
) connected
between CZP and CZN. The poles associated with C
IN
and C
AZ
must work together to provide a flat response
at the lower -3dB corner frequency. For SFP/SFF, FDDI,
155Mbps ATM LAN, Fast Ethernet, and ESCON
receivers, Maxim recommends the following:
C
IN
= 4700pF
C
AZ
= 1µF
MAX3969
200Mbps SFP Limiting Amplifier
_______________________________________________________________________________________ 7
V
CCO
OUT-
OUT+
ESD
STRUCTURES
Figure 2. Equivalent PECL Output Circuit
LOS/LOS
ESD
STRUCTURES
V
CCO
Figure 3. Equivalent TTL Output Circuit
PIN-TIA RESPONSIVITY = G
1.8dB
2.5dB
10 log(OPTICAL POWER)
20 log(V
IN
)
RX_MAX (SENSITIVITY)
SD HIGH / LOS LOW
SD LOW / LOS HIGH
5dB
3.6dB
V
IN_TH
V
IN_SEN
Figure 4. Signal Levels for Power-Detect Threshold
MAX3969
Applications Information
Wire Bonding
For high-current density and reliable operation, the
MAX3969 uses gold metalization. For best results, use
gold-wire ball-bonding techniques. Use caution if
attempting wedge bonding. Die pad size is 4 mils x 4
mils. Die thickness is 16 mils.
Table 1 lists the bond pad coordinates for the MAX3969.
The origin for pad coordinates is defined as the bottom
left corner of the bottom left pad. All pad locations are
referenced from the origin and indicate the center of the
pad where the bond wire should be connected. Refer to
Maxim Application Note HFAN-08.0.1: Understanding
Bonding-Coordinates and Physical Die Size for detailed
information.
200Mbps SFP Limiting Amplifier
8 _______________________________________________________________________________________
COORDINATES (μm)
PAD NAME
XY
1 INV 46.6 659.5
2 FILTER 46.6 505.6
3 RSSI 46.6 351.7
4 IN- 46.6 197.8
5 IN+ 46.6 46.6
6 GND 195.1 -99.1
7 GND 432.7 -99.1
8 GND 589.3 -99.1
9 CZP 743.2 -99.1
10 CZN 945.7 -99.1
11 V
CCO
1204.9 -96.4
12 OUT+ 1204.9 81.7
13 OUT- 1204.9 262.6
14 SD 1204.9 492.1
15 LOS 1204.9 697.3
16 LOS 1053.7 818.8
17 V
CC
808.0 818.8
18 V
CC
586.6 818.8
19
SQUELCH
432.7 818.8
20 V
TH
195.1 818.8
Table 1. Bond Pad Coordinates
CONNECT EXPOSED PAD (EP) TO CIRCUIT BOARD GROUND.
19 18 17
V
TH
SQUELCH
V
CC
V
CC
16
LOS
13
12
11
14
15
OUT+
OUT-
SD
LOS
V
CCO
4
3
2
1
IN-
RSSI
FILTER
INV
5IN+
6789
GND
GND
GND
CZP
10
CZN
MAX3969
TOP VIEW
THIN QFN
Pin Configuration
Chip Information
TRANSISTOR COUNT: 915
SUBSTRATE CONNECTED TO GND
PROCESS: Silicon Bipolar
DIE THICKNESS: 16 mils
MAX3969
200Mbps SFP Limiting Amplifier
_______________________________________________________________________________________ 9
GND
LOS
SD
OUT-
OUT+
47mil
(1.19mm)
57mil
(1.45mm)
FILTER
RSSI
IN-
IN+
INV
V
TH
V
CC
SQUELCH
V
CCO
GND
GND CZP
CZN
V
CC
LOS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1718
19
20
ORIGIN
Chip Topography
P1-P3P4-P6P7-P9P10-P11

MAX3969ETP+T

Mfr. #:
Buy MAX3969ETP+T
Manufacturer:
Maxim Integrated
Description:
Limiting Amplifiers 270Mbps SFP LED
Lifecycle:
New from this manufacturer.
Delivery:
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