Enhanced Product ADG904-EP
Rev. A | Page 11 of 11
OUTLINE DIMENSIONS
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-1.
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
08-16-2010-B
Fig
ure 23. 20-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG904SCPZ-EP −55°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP] CP-20-6
ADG904SCPZ-EP-RL7 −55°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP] CP-20-6
1
Z = RoHS Compliant Part.
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D14326-0-3/17(B)
